Title: Zener diode protection network in submount for LEDs connected in series

Abstract

A transient voltage suppressor circuit is disclosed for a plurality (N) of LEDs connected in series. Only one zener diode is created for connection to each node between LEDs, and a pair of zener diodes (the “end” zener diodes) are connected to the two pins (anode and cathode pads) of the series string. Therefore, only N+1 zener diodes are used. The end zener diodes (Q1 and Qn+1) effectively create back-to-back zener diodes across the two pins since the zener diodes share a common p+ substrate. The n+ regions of the end zener diodes Q1 and Qn+1 have the highest breakdown voltage requirement and must be placed relatively far apart. Adjacent n+ regions of the intermediate zener diodes have a much lower breakdown voltage requirement so may be located close together. The zener diodes may be placed within a very small footprint or can be larger for better suppressor performance.

Inventors:

Wei, Yajun; Collins, III, William D.; Steigerwald, Daniel A.

Issue Date:

Tue Mar 19 00:00:00 EDT 2013

Research Org.:

Lumileds Lighting U.S., LLC, San Jose, CA (United States); Koninklijke Philips Electronics N.V., Eindhoven (Netherlands)

Sponsoring Org.:

USDOE

OSTI Identifier:

1531848

Patent Number(s):

8400064

Application Number:

12/556,054

Assignee:

Koninklijke Philips Electronics N.V. (Eindhoven, NL); Philips Lumileds Lighting Company, LLC (San Jose, CA)

Patent Classifications (CPCs):

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05B - ELECTRIC HEATING

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L2224/16225 - the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L25/0753 - {the devices being arranged next to each other}
H01L25/167 - {comprising optoelectronic devices, e.g. LED, photodiodes}
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05B - ELECTRIC HEATING

H05B45/48 - having LEDs organised in strings and incorporating parallel shunting devices
H05B45/54 - in a series array of LEDs

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02B - CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS

Y02B20/30 - Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

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DOE Contract Number:  

FC26-08NT01583

Resource Type:

Patent

Resource Relation:

Patent File Date: 2009-09-09; Related Information: This invention was made with Government support under contract DE-FC26-08NT01583 awarded by DOE. The Government has certain rights in this invention.

Country of Publication:

United States

Language:

English