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Title: Ground-referenced single-ended signaling connected graphics processing unit multi-chip module

Abstract

A system of interconnected chips comprising a multi-chip module (MCM) includes a first processor chip, a graphics processing cluster (GPC) chip, and an MCM package configured to include the first processor chip, the GPC chip, and an interconnect circuit. The first processor chip is configured to include a first ground-referenced single-ended signaling interface circuit. A first set of electrical traces fabricated within the MCM package and configured to couple the first single-ended signaling interface circuit to the interconnect circuit. The GPC chip is configured to include a second single-ended signaling interface circuit and to execute shader programs. A second set of electrical traces fabricated within the MCM package and configured to couple the second single-ended signaling interface circuit to the interconnect circuit. In one embodiment, each single-ended signaling interface advantageously implements ground-referenced single-ended signaling.

Inventors:
; ; ;
Issue Date:
Research Org.:
NVIDIA Corp., Santa Clara, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1531817
Patent Number(s):
9153539
Application Number:
13/973,947
Assignee:
NVIDIA Corporation (Santa Clara, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H03 - BASIC ELECTRONIC CIRCUITRY H03K - PULSE TECHNIQUE
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
B599861
Resource Type:
Patent
Resource Relation:
Patent File Date: 2013-08-22
Country of Publication:
United States
Language:
English

Citation Formats

Dally, William J., Alben, Jonah M., Poulton, John W., and Greer, III, Thomas Hastings. Ground-referenced single-ended signaling connected graphics processing unit multi-chip module. United States: N. p., 2015. Web.
Dally, William J., Alben, Jonah M., Poulton, John W., & Greer, III, Thomas Hastings. Ground-referenced single-ended signaling connected graphics processing unit multi-chip module. United States.
Dally, William J., Alben, Jonah M., Poulton, John W., and Greer, III, Thomas Hastings. Tue . "Ground-referenced single-ended signaling connected graphics processing unit multi-chip module". United States. https://www.osti.gov/servlets/purl/1531817.
@article{osti_1531817,
title = {Ground-referenced single-ended signaling connected graphics processing unit multi-chip module},
author = {Dally, William J. and Alben, Jonah M. and Poulton, John W. and Greer, III, Thomas Hastings},
abstractNote = {A system of interconnected chips comprising a multi-chip module (MCM) includes a first processor chip, a graphics processing cluster (GPC) chip, and an MCM package configured to include the first processor chip, the GPC chip, and an interconnect circuit. The first processor chip is configured to include a first ground-referenced single-ended signaling interface circuit. A first set of electrical traces fabricated within the MCM package and configured to couple the first single-ended signaling interface circuit to the interconnect circuit. The GPC chip is configured to include a second single-ended signaling interface circuit and to execute shader programs. A second set of electrical traces fabricated within the MCM package and configured to couple the second single-ended signaling interface circuit to the interconnect circuit. In one embodiment, each single-ended signaling interface advantageously implements ground-referenced single-ended signaling.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2015},
month = {10}
}

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Works referenced in this record:

Regulated inverting power supply
patent, September 2000


Ground Referenced Single-Ended Signaling
patent-application, February 2014


Charge domain filter and method thereof
patent, April 2014


Semiconductor chip and multi-chip package
patent, August 2010


On-package multiprocessor ground-referenced single-ended interconnect
patent, October 2014


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Multi-chip build-up package of optoelectronic chip
patent, October 2008


Uniform multi-chip identification and routing system
patent, December 2013


Ground-Referenced Single-Ended Memory Interconnect
patent-application, September 2014


Systems and methods for control with a multi-chip module with multiple dies
patent, September 2013


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