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Title: Thermal evaporation sources for wide-area deposition

Abstract

A thermal evaporation source includes: a crucible configured to contain a volume of evaporant and a vapor space above the evaporant; a manifold body having within it a hollow expansion chamber that is flowably connected to the vapor space via one or more restriction orifices; one or more effusion nozzles flowably connected to the expansion chamber and exiting an outer surface of the thermal evaporation source, the nozzle(s) oriented to direct an evaporant vapor flow out of the source vertically downward, in one or more horizontal directions, or in one or more directions intermediate between horizontal and vertically downward; and a heater capable of heating some or all of the thermal evaporation source to a temperature sufficient to produce the one or more evaporant vapor flows when a vacuum is applied to the thermal evaporation source.

Inventors:
;
Issue Date:
Research Org.:
JLN Solar, Inc., Mill Valley, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1531797
Patent Number(s):
8,986,455
Application Number:
12/250,172
Assignee:
JLN Solar, Inc. (Mill Valley, CA)
DOE Contract Number:  
ADJ-1-30630-12
Resource Type:
Patent
Resource Relation:
Patent File Date: 2008-10-13
Country of Publication:
United States
Language:
English

Citation Formats

Birkmire, Robert W., and Hanket, Gregory M. Thermal evaporation sources for wide-area deposition. United States: N. p., 2015. Web.
Birkmire, Robert W., & Hanket, Gregory M. Thermal evaporation sources for wide-area deposition. United States.
Birkmire, Robert W., and Hanket, Gregory M. Tue . "Thermal evaporation sources for wide-area deposition". United States. https://www.osti.gov/servlets/purl/1531797.
@article{osti_1531797,
title = {Thermal evaporation sources for wide-area deposition},
author = {Birkmire, Robert W. and Hanket, Gregory M.},
abstractNote = {A thermal evaporation source includes: a crucible configured to contain a volume of evaporant and a vapor space above the evaporant; a manifold body having within it a hollow expansion chamber that is flowably connected to the vapor space via one or more restriction orifices; one or more effusion nozzles flowably connected to the expansion chamber and exiting an outer surface of the thermal evaporation source, the nozzle(s) oriented to direct an evaporant vapor flow out of the source vertically downward, in one or more horizontal directions, or in one or more directions intermediate between horizontal and vertically downward; and a heater capable of heating some or all of the thermal evaporation source to a temperature sufficient to produce the one or more evaporant vapor flows when a vacuum is applied to the thermal evaporation source.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2015},
month = {3}
}

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Works referenced in this record:

Method for continuous deposition by vacuum evaporation
patent, April 1982


Apparatus for continuous deposition by vacuum evaporation
patent, August 1983


Method of using an evaporation source
patent, November 1985


Fabrication of thin-film, flexible photovoltaic module
patent, April 2002


Multiple-nozzle thermal evaporation source
patent, May 2003


Multiple-nozzle thermal evaporation source
patent, January 2006


    Works referencing / citing this record:

    Thermal evaporation sources for wide-area deposition
    patent, August 2017