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Title: Polymer-embedded semiconductor rod arrays

Abstract

A structure consisting of well-ordered semiconductor structures embedded in a binder material which maintains the ordering and orientation of the semiconductor structures. Methods for forming such a structure include forming the semiconductor structures on a substrate, casting a binder material onto the substrate to embed the semiconductor structures in the binder material, and separating the binder material from the substrate at the substrate. These methods provide for the retention of the orientation and order of highly ordered semiconductor structures in the separated binder material.

Inventors:
; ; ;
Issue Date:
Research Org.:
California Inst. of Technology, Pasadena, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1531719
Patent Number(s):
8,110,898
Application Number:
12/176,065
Assignee:
California Institute of Technology (Pasadena, CA)
DOE Contract Number:  
FG02-03ER15483
Resource Type:
Patent
Resource Relation:
Patent File Date: 2008-07-18
Country of Publication:
United States
Language:
English

Citation Formats

Lewis, Nathan S., Plass, Katherine E., Spurgeon, Joshua M., and Atwater, Harry A. Polymer-embedded semiconductor rod arrays. United States: N. p., 2012. Web.
Lewis, Nathan S., Plass, Katherine E., Spurgeon, Joshua M., & Atwater, Harry A. Polymer-embedded semiconductor rod arrays. United States.
Lewis, Nathan S., Plass, Katherine E., Spurgeon, Joshua M., and Atwater, Harry A. Tue . "Polymer-embedded semiconductor rod arrays". United States. https://www.osti.gov/servlets/purl/1531719.
@article{osti_1531719,
title = {Polymer-embedded semiconductor rod arrays},
author = {Lewis, Nathan S. and Plass, Katherine E. and Spurgeon, Joshua M. and Atwater, Harry A.},
abstractNote = {A structure consisting of well-ordered semiconductor structures embedded in a binder material which maintains the ordering and orientation of the semiconductor structures. Methods for forming such a structure include forming the semiconductor structures on a substrate, casting a binder material onto the substrate to embed the semiconductor structures in the binder material, and separating the binder material from the substrate at the substrate. These methods provide for the retention of the orientation and order of highly ordered semiconductor structures in the separated binder material.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2012},
month = {2}
}

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