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Title: Organic vapor jet deposition using an exhaust

Abstract

Methods and systems for organic vapor jet deposition are provided, where an exhaust is disposed between adjacent nozzles. One or more carrier gases may be provided and ejected from a plurality of nozzles. An exhaust may be provided to create a localized vacuum between nozzles. The exhaust may reduce pressure buildup in the nozzles and between the nozzles and the substrate, leading to improved deposition profiles, resolution, and improved nozzle-to-nozzle uniformity. The exhaust may be in fluid communication with an ambient vacuum, or may be directly connected to a vacuum source.

Inventors:
;
Issue Date:
Research Org.:
Univ. of Michigan, Ann Arbor, MI (United States); Princeton Univ., NJ (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1531670
Patent Number(s):
7,879,401
Application Number:
11/643,795
Assignee:
The Regents of the University of Michigan (Ann Arbor, MI); The Trustees of Princeton University (Princeton, NJ)
DOE Contract Number:  
FC26-04NT42273
Resource Type:
Patent
Resource Relation:
Patent File Date: 2006-12-22
Country of Publication:
United States
Language:
English

Citation Formats

Forrest, Stephen, and Lunt, Richard. Organic vapor jet deposition using an exhaust. United States: N. p., 2011. Web.
Forrest, Stephen, & Lunt, Richard. Organic vapor jet deposition using an exhaust. United States.
Forrest, Stephen, and Lunt, Richard. Tue . "Organic vapor jet deposition using an exhaust". United States. https://www.osti.gov/servlets/purl/1531670.
@article{osti_1531670,
title = {Organic vapor jet deposition using an exhaust},
author = {Forrest, Stephen and Lunt, Richard},
abstractNote = {Methods and systems for organic vapor jet deposition are provided, where an exhaust is disposed between adjacent nozzles. One or more carrier gases may be provided and ejected from a plurality of nozzles. An exhaust may be provided to create a localized vacuum between nozzles. The exhaust may reduce pressure buildup in the nozzles and between the nozzles and the substrate, leading to improved deposition profiles, resolution, and improved nozzle-to-nozzle uniformity. The exhaust may be in fluid communication with an ambient vacuum, or may be directly connected to a vacuum source.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2011},
month = {2}
}

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Works referenced in this record:

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