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Title: Method for determining defect depth using thermal imaging

Abstract

A method and apparatus are provided for determining the thickness of a sample and defect depth using thermal imaging in a variety of plastic, ceramic, metal and other products. A pair of flash lamps is positioned at a first side of the sample. An infrared camera is positioned near the first side of the sample. A data acquisition and processing computer is coupled to the flash lamps for triggering the flash lamps. The data acquisition and processing computer is coupled to the infrared camera for acquiring and processing thermal image data. The thermal image data are processed using a theoretical solution to analyze the thermal image data to determine the thickness of a sample and defect depth.

Inventors:
Issue Date:
Research Org.:
Univ. of Chicago, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1531452
Patent Number(s):
6,542,849
Application Number:
09/766,214
Assignee:
The University of Chicago (Chicago, IL)
DOE Contract Number:  
W-31-109-ENG-38
Resource Type:
Patent
Resource Relation:
Patent File Date: 2001-01-19
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Sun, Jiangang. Method for determining defect depth using thermal imaging. United States: N. p., 2003. Web.
Sun, Jiangang. Method for determining defect depth using thermal imaging. United States.
Sun, Jiangang. Tue . "Method for determining defect depth using thermal imaging". United States. https://www.osti.gov/servlets/purl/1531452.
@article{osti_1531452,
title = {Method for determining defect depth using thermal imaging},
author = {Sun, Jiangang},
abstractNote = {A method and apparatus are provided for determining the thickness of a sample and defect depth using thermal imaging in a variety of plastic, ceramic, metal and other products. A pair of flash lamps is positioned at a first side of the sample. An infrared camera is positioned near the first side of the sample. A data acquisition and processing computer is coupled to the flash lamps for triggering the flash lamps. The data acquisition and processing computer is coupled to the infrared camera for acquiring and processing thermal image data. The thermal image data are processed using a theoretical solution to analyze the thermal image data to determine the thickness of a sample and defect depth.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2003},
month = {4}
}

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Works referenced in this record:

Automated real-time detection of defects during machining of ceramics
patent, November 1997


Crack sizing
patent, May 1989


Nondestructive testing: transient depth thermography
patent, January 1998


    Works referencing / citing this record:

    Method and apparatus for thermographic nondestructive evaluation of an object
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    Transient defect detection algorithm
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    Method and apparatus for detecting defects in a material in a liquid bath
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    Material analysis
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    Thermal imaging method and apparatus
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    Lamp assembly for a thermographic nondestructive evaluation system
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    Method for measuring thickness by pulsed infrared thermal wave technology
    patent, October 2016


    Automatic detection of coating flaws
    patent, August 2011


    Thermal imaging method and apparatus for evaluating coatings
    patent, April 2014