Method for determining defect depth using thermal imaging
Abstract
A method and apparatus are provided for determining the thickness of a sample and defect depth using thermal imaging in a variety of plastic, ceramic, metal and other products. A pair of flash lamps is positioned at a first side of the sample. An infrared camera is positioned near the first side of the sample. A data acquisition and processing computer is coupled to the flash lamps for triggering the flash lamps. The data acquisition and processing computer is coupled to the infrared camera for acquiring and processing thermal image data. The thermal image data are processed using a theoretical solution to analyze the thermal image data to determine the thickness of a sample and defect depth.
- Inventors:
- Issue Date:
- Research Org.:
- Univ. of Chicago, IL (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1531452
- Patent Number(s):
- 6542849
- Application Number:
- 09/766,214
- Assignee:
- The University of Chicago (Chicago, IL)
- Patent Classifications (CPCs):
-
G - PHYSICS G01 - MEASURING G01B - MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS
- DOE Contract Number:
- W-31-109-ENG-38
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2001-01-19
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Sun, Jiangang. Method for determining defect depth using thermal imaging. United States: N. p., 2003.
Web.
Sun, Jiangang. Method for determining defect depth using thermal imaging. United States.
Sun, Jiangang. Tue .
"Method for determining defect depth using thermal imaging". United States. https://www.osti.gov/servlets/purl/1531452.
@article{osti_1531452,
title = {Method for determining defect depth using thermal imaging},
author = {Sun, Jiangang},
abstractNote = {A method and apparatus are provided for determining the thickness of a sample and defect depth using thermal imaging in a variety of plastic, ceramic, metal and other products. A pair of flash lamps is positioned at a first side of the sample. An infrared camera is positioned near the first side of the sample. A data acquisition and processing computer is coupled to the flash lamps for triggering the flash lamps. The data acquisition and processing computer is coupled to the infrared camera for acquiring and processing thermal image data. The thermal image data are processed using a theoretical solution to analyze the thermal image data to determine the thickness of a sample and defect depth.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2003},
month = {4}
}
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