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Title: Pin array assembly and method of manufacture

Abstract

An improved pin array assembly and method of manufacture of the pin array assembly are provided. A pin array assembly includes a single crystal silicon wafer. The single crystal silicon wafer is formed to define a base and an array of pins. Each of the pins has a shaft and a tip surface. The pin shaft is hydrophobic and the pin tip surface is hydrophilic. The method of manufacture of the pin array assembly includes the steps of forming an initial shape of a single crystal silicon wafer to define a base and an array of pins. The initial shape of a single crystal silicon wafer is etched and the array of pins is polished. The step of forming an initial shape of a single crystal silicon wafer to define a base and an array of pins includes mechanically sawing the single crystal silicon wafer to define a base and an array of pins. Chemical treatment of the pins is performed to make the shaft of the pins hydrophobic and to make the pin tip surfaces hydrophilic.

Inventors:
; ;
Issue Date:
Research Org.:
The Univ. of Chicago, Chicago, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1531446
Patent Number(s):
6,455,352
Application Number:
09/653,672
Assignee:
The University of Chicago (Chicago, IL)
DOE Contract Number:  
W-31-109-ENG-38
Resource Type:
Patent
Resource Relation:
Patent File Date: 2000-09-01
Country of Publication:
United States
Language:
English

Citation Formats

Pikarsky, Joel, Hesketh, Peter, and Yershov, Gennadiy. Pin array assembly and method of manufacture. United States: N. p., 2002. Web.
Pikarsky, Joel, Hesketh, Peter, & Yershov, Gennadiy. Pin array assembly and method of manufacture. United States.
Pikarsky, Joel, Hesketh, Peter, and Yershov, Gennadiy. Tue . "Pin array assembly and method of manufacture". United States. https://www.osti.gov/servlets/purl/1531446.
@article{osti_1531446,
title = {Pin array assembly and method of manufacture},
author = {Pikarsky, Joel and Hesketh, Peter and Yershov, Gennadiy},
abstractNote = {An improved pin array assembly and method of manufacture of the pin array assembly are provided. A pin array assembly includes a single crystal silicon wafer. The single crystal silicon wafer is formed to define a base and an array of pins. Each of the pins has a shaft and a tip surface. The pin shaft is hydrophobic and the pin tip surface is hydrophilic. The method of manufacture of the pin array assembly includes the steps of forming an initial shape of a single crystal silicon wafer to define a base and an array of pins. The initial shape of a single crystal silicon wafer is etched and the array of pins is polished. The step of forming an initial shape of a single crystal silicon wafer to define a base and an array of pins includes mechanically sawing the single crystal silicon wafer to define a base and an array of pins. Chemical treatment of the pins is performed to make the shaft of the pins hydrophobic and to make the pin tip surfaces hydrophilic.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2002},
month = {9}
}

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Works referenced in this record:

Systems and methods for preparing low volume analyte array elements
patent, February 2000


Method and apparatus for making arrays
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Method of dispensing microdoses of aqueous solutions of substances onto a carrier and a device for carrying out said method
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Method of transferring a liquid drop from a multiwell plate and/or chemical assay
patent, October 2001


Device of dispensing micro doses of aqueous solutions of substances onto a carrier and device for carrying out said method
patent, May 1998


Reagent transfer device
patent, July 2001


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