Modified eddy current probe for low conductivity surfaces
Abstract
A modified eddy current (MEC) probe includes a probe body having a bore formed therein. A printed circuit board (PCB) assembly includes a circuit board defining a plane, has a plurality of electronic components mounted thereon, and is configured for mounting within the bore of the probe body. A coil board assembly is electrically connected to the PCB assembly and comprises a coil board defining a plane, a transmitter coil formed on a first side of the coil board, and a sensor coil formed on second side of the coil board. The plane of the coil board is arranged orthogonally to the plane of the circuit board.
- Inventors:
- Issue Date:
- Research Org.:
- Centrus Energy Corp., Bethesda, MD (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1531355
- Patent Number(s):
- 10041812
- Application Number:
- 15/413,504
- Assignee:
- Centrus Energy Corp. (Bethesda, MD)
- Patent Classifications (CPCs):
-
G - PHYSICS G01 - MEASURING G01D - MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- 4000130255; ORNL00-0579
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2017-01-24
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Simpson, Marc L., Emery, Michael S., and Dodd, Caius V. Modified eddy current probe for low conductivity surfaces. United States: N. p., 2018.
Web.
Simpson, Marc L., Emery, Michael S., & Dodd, Caius V. Modified eddy current probe for low conductivity surfaces. United States.
Simpson, Marc L., Emery, Michael S., and Dodd, Caius V. Tue .
"Modified eddy current probe for low conductivity surfaces". United States. https://www.osti.gov/servlets/purl/1531355.
@article{osti_1531355,
title = {Modified eddy current probe for low conductivity surfaces},
author = {Simpson, Marc L. and Emery, Michael S. and Dodd, Caius V.},
abstractNote = {A modified eddy current (MEC) probe includes a probe body having a bore formed therein. A printed circuit board (PCB) assembly includes a circuit board defining a plane, has a plurality of electronic components mounted thereon, and is configured for mounting within the bore of the probe body. A coil board assembly is electrically connected to the PCB assembly and comprises a coil board defining a plane, a transmitter coil formed on a first side of the coil board, and a sensor coil formed on second side of the coil board. The plane of the coil board is arranged orthogonally to the plane of the circuit board.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {8}
}
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Works referenced in this record:
Pulsed eddy current sensor probes and inspection methods
patent-application, December 2004
- Plotnikov, Yuri Alexeyevich; Batzinger, Thomas James; Nath, Shridhar Champaknath
- US Patent Application 10/727401; 20040245997
Board for mounting display element
patent, August 1999
- Tijanoc, Veso S.; Dennis, Matthew D.; Wong, Coeman L. S.
- US Patent Document 5,933,329