Title: Cold plate

Abstract

A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and an opposing plate that form a plenum. The cold plate includes a plurality of active areas arranged for alignment over respective heat generating portions of an electronic assembly, and non-active areas between the active areas. A cooling fluid flows through the plenum. The plenum, at the non-active areas, has a reduced width and/or reduced height relative to the plenum at the active areas. The reduced width and/or height of the plenum, and exterior dimensions of cold plate, at the non-active areas allow the non-active areas to flex to accommodate surface variations of the electronics assembly. The reduced width and/or height non-active areas can be specifically shaped to fit between physical features of the electronics assembly.

Inventors:

Marroquin, Christopher M.; O'Connell, Kevin M.; Schultz, Mark D.; Tian, Shurong

Issue Date:

2019-03-12

Research Org.:

International Business Machines Corp., Armonk, NY (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1525040

Patent Number(s):

10231356

Application Number:

15/803,945

Assignee:

International Business Machines Corporation (Armonk, NY)

Patent Classifications (CPCs):

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L23/473 - by flowing liquids {

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K7/20254 - {Cold plates transferring heat from heat source to coolant}
H05K7/2049 - {Pressing means used to urge contact, e.g. springs}
H05K7/20509 - {Cold plates, e.g. multi-component heat spreader, support plates, non closed structures}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L23/427 - Cooling by change of state, e.g. use of heat pipes {

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DOE Contract Number:  

4000131696; B604142

Resource Type:

Patent

Resource Relation:

Patent File Date: 2017-11-06

Country of Publication:

United States

Language:

English

Subject:

42 ENGINEERING