Method of manufacturing a micro heatsink by an additive process

Title: Method of manufacturing a micro heatsink by an additive process

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Abstract

A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.

Inventors:: Pascall, Andrew J.; Coe, Hannah Grace; Jackson, Julie A.; Patra, Susant K.

Issue Date:: 2019-03-05

Research Org.:: Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1525027

Patent Number(s):: 10221498

Application Number:: 14/823,194

Assignee:: Lawrence Livermore National Security, LLC (Livermore, CA)

Patent Classifications (CPCs):: C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS

B - PERFORMING OPERATIONS B33 - ADDITIVE MANUFACTURING TECHNOLOGY B33Y - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING

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C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
C25D1/14 - of inorganic material

B - PERFORMING OPERATIONS B33 - ADDITIVE MANUFACTURING TECHNOLOGY B33Y - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
B33Y80/00 - Products made by additive manufacturing

C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
C25D13/12 - characterised by the article coated

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
F28F2260/02 - having microchannels

B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23P - OTHER WORKING OF METAL
B23P2700/10 - Heat sinks

C - CHEMISTRY C22 - METALLURGY C22C - ALLOYS
C22C26/00 - Alloys containing diamond {or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes}

C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
C25D13/02 - with inorganic material

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
F28F21/08 - of metal
F28F21/02 - of carbon, e.g. graphite

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
F28D2021/0029 - {Heat sinks}

C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
C25D15/02 - Combined electrolytic and electrophoretic processes {with charged materials}
C25D1/16 - Metals

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
F28F21/04 - of ceramic

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/49982 - Coating

B - PERFORMING OPERATIONS B33 - ADDITIVE MANUFACTURING TECHNOLOGY B33Y - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
B33Y10/00 - Processes of additive manufacturing

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/4935 - Heat exchanger or boiler making

C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
C25D15/00 - Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
C25D1/003 - {3D structures, e.g. superposed patterned layers}

B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23P - OTHER WORKING OF METAL
B23P15/26 - heat exchangers {or the like

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
F28F3/12 - Elements constructed in the shape of a hollow panel, e.g. with channels {

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DOE Contract Number:: AC52-07NA27344

Resource Type:: Patent

Resource Relation:: Patent File Date: 2015-08-11

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE

Citation Formats


                    Pascall, Andrew J., Coe, Hannah Grace, Jackson, Julie A., and Patra, Susant K. Method of manufacturing a micro heatsink by an additive process.  United States: N. p., 2019. 
        Web.

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                    Pascall, Andrew J., Coe, Hannah Grace, Jackson, Julie A., & Patra, Susant K. Method of manufacturing a micro heatsink by an additive process.  United States.

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                    Pascall, Andrew J., Coe, Hannah Grace, Jackson, Julie A., and Patra, Susant K. Tue .  
        "Method of manufacturing a micro heatsink by an additive process".  United States.  https://www.osti.gov/servlets/purl/1525027.

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@article{osti_1525027,

  title        = {Method of manufacturing a micro heatsink by an additive process},

  author       = {Pascall, Andrew J. and Coe, Hannah Grace and Jackson, Julie A. and Patra, Susant K.},

  abstractNote = {A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2019},

  month        = {3}

}

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