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Title: Method of manufacturing a micro heatsink by an additive process

Abstract

A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.

Inventors:
; ; ;
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1525027
Patent Number(s):
10,221,498
Application Number:
14/823,194
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015-08-11
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Pascall, Andrew J., Coe, Hannah Grace, Jackson, Julie A., and Patra, Susant K. Method of manufacturing a micro heatsink by an additive process. United States: N. p., 2019. Web.
Pascall, Andrew J., Coe, Hannah Grace, Jackson, Julie A., & Patra, Susant K. Method of manufacturing a micro heatsink by an additive process. United States.
Pascall, Andrew J., Coe, Hannah Grace, Jackson, Julie A., and Patra, Susant K. Tue . "Method of manufacturing a micro heatsink by an additive process". United States. https://www.osti.gov/servlets/purl/1525027.
@article{osti_1525027,
title = {Method of manufacturing a micro heatsink by an additive process},
author = {Pascall, Andrew J. and Coe, Hannah Grace and Jackson, Julie A. and Patra, Susant K.},
abstractNote = {A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {3}
}

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Works referenced in this record:

Electrophoretic diamond coating and compositions for effecting same
patent, July 2001


Micro-heatpipe cooled laser diode array
patent, May 1994


Microchannel heat sink assembly
patent, March 1992


Method of making a micro-channel array device
patent, July 2012


Bubble generator
patent, August 2007