Method of manufacturing a micro heatsink by an additive process
Abstract
A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.
- Inventors:
- Issue Date:
- Research Org.:
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1525027
- Patent Number(s):
- 10,221,498
- Application Number:
- 14/823,194
- Assignee:
- Lawrence Livermore National Security, LLC (Livermore, CA)
- DOE Contract Number:
- AC52-07NA27344
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2015-08-11
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Pascall, Andrew J., Coe, Hannah Grace, Jackson, Julie A., and Patra, Susant K. Method of manufacturing a micro heatsink by an additive process. United States: N. p., 2019.
Web.
Pascall, Andrew J., Coe, Hannah Grace, Jackson, Julie A., & Patra, Susant K. Method of manufacturing a micro heatsink by an additive process. United States.
Pascall, Andrew J., Coe, Hannah Grace, Jackson, Julie A., and Patra, Susant K. Tue .
"Method of manufacturing a micro heatsink by an additive process". United States. https://www.osti.gov/servlets/purl/1525027.
@article{osti_1525027,
title = {Method of manufacturing a micro heatsink by an additive process},
author = {Pascall, Andrew J. and Coe, Hannah Grace and Jackson, Julie A. and Patra, Susant K.},
abstractNote = {A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {3}
}
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Works referenced in this record:
Electrophoretic diamond coating and compositions for effecting same
patent, July 2001
- Gal-Or, Leah; Goldner, Rony; Sezin, Nina
- US Patent Document 6,258,237
Method and means for improved heat removal in compact semiconductor integrated circuits
patent, February 1986
- Tuckerman, David B.; Pease, Roger F.
- US Patent Document 4,573,067
Micro-heatpipe cooled laser diode array
patent, May 1994
- Minch, Richard B.
- US Patent Document 5,309,457
Dynamic mask projection stereo micro lithography
patent, August 2006
- Zhang, Xiang
- US Patent Document 7,088,432
Microchannel heat sink assembly
patent, March 1992
- Bonde, Wayne L.; Contolini, Robert J.
- US Patent Document 5,099,311
Method of making a micro-channel array device
patent, July 2012
- Clarkin, James P.; Nelson, Gary W.; Macomber, Robert Joseph
- US Patent Document 8,216,980