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Title: Burst resistant thin wall heat sink

Abstract

An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1525024
Patent Number(s):
10222125
Application Number:
14/818,064
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23P - OTHER WORKING OF METAL
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
B601996; B604142
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015-08-04
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Coteus, Paul W., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., and Tian, Shurong. Burst resistant thin wall heat sink. United States: N. p., 2019. Web.
Coteus, Paul W., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., & Tian, Shurong. Burst resistant thin wall heat sink. United States.
Coteus, Paul W., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., and Tian, Shurong. Tue . "Burst resistant thin wall heat sink". United States. https://www.osti.gov/servlets/purl/1525024.
@article{osti_1525024,
title = {Burst resistant thin wall heat sink},
author = {Coteus, Paul W. and Hall, Shawn A. and Schultz, Mark D. and Takken, Todd E. and Tian, Shurong},
abstractNote = {An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {3}
}

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