Title: Flexible cold plate with enhanced flexibility

Abstract

An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The joined planar top and bottom members have a sidewall structure of reduced height (and generally the height of the cold plate) between active areas in order to improve flexibility. The stiffness of the sidewalls is reduced by very advantageously reduce the height of the sidewalls. In one embodiment, the sidewalls are shorter in height corresponding to regions only between active areas. Alternatively, the sidewalls are of reduced height everywhere by insetting the active areas within the top and/or bottom sheets.

Inventors:

Coteus, Paul W.; Hall, Shawn A.; Schultz, Mark D.; Takken, Todd E.; Tian, Shurong

Issue Date:

2019-02-26

Research Org.:

International Business Machines Corp., Armonk, NY (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1524986

Patent Number(s):

10215504

Application Number:

14/818,117

Assignee:

International Business Machines Corporation (Armonk, NY)

Patent Classifications (CPCs):

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION

F28F3/044 - {the deformations being pontual, e.g. dimples}
F28F2225/04 - for conduits

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L23/473 - by flowing liquids {

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION

F28F3/12 - Elements constructed in the shape of a hollow panel, e.g. with channels {

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K7/20254 - {Cold plates transferring heat from heat source to coolant}

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION

F28F2255/02 - Flexible elements

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DOE Contract Number:  

B601996; B604142

Resource Type:

Patent

Resource Relation:

Patent File Date: 2015-08-04

Country of Publication:

United States

Language:

English

Subject:

42 ENGINEERING