DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Flexible cold plate with enhanced flexibility

Abstract

An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The joined planar top and bottom members have a sidewall structure of reduced height (and generally the height of the cold plate) between active areas in order to improve flexibility. The stiffness of the sidewalls is reduced by very advantageously reduce the height of the sidewalls. In one embodiment, the sidewalls are shorter in height corresponding to regions only between active areas. Alternatively, the sidewalls are of reduced height everywhere by insetting the active areas within the top and/or bottom sheets.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1524986
Patent Number(s):
10215504
Application Number:
14/818,117
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Classifications (CPCs):
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
B601996; B604142
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015-08-04
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Coteus, Paul W., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., and Tian, Shurong. Flexible cold plate with enhanced flexibility. United States: N. p., 2019. Web.
Coteus, Paul W., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., & Tian, Shurong. Flexible cold plate with enhanced flexibility. United States.
Coteus, Paul W., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., and Tian, Shurong. Tue . "Flexible cold plate with enhanced flexibility". United States. https://www.osti.gov/servlets/purl/1524986.
@article{osti_1524986,
title = {Flexible cold plate with enhanced flexibility},
author = {Coteus, Paul W. and Hall, Shawn A. and Schultz, Mark D. and Takken, Todd E. and Tian, Shurong},
abstractNote = {An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The joined planar top and bottom members have a sidewall structure of reduced height (and generally the height of the cold plate) between active areas in order to improve flexibility. The stiffness of the sidewalls is reduced by very advantageously reduce the height of the sidewalls. In one embodiment, the sidewalls are shorter in height corresponding to regions only between active areas. Alternatively, the sidewalls are of reduced height everywhere by insetting the active areas within the top and/or bottom sheets.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {2}
}

Works referenced in this record:

Multi-chip-module
patent, September 1992


Cooling device with heat pipe
patent, August 2001


Electronic assembly having a heat pipe that conducts heat from a semiconductor die
patent, March 2003


Flat type heat pipe
patent, June 2002


Plate-type evaporator to suppress noise and maintain thermal performance
patent, September 2007


Method and apparatus for temperature gradient control in an electronic system
patent, March 2006


Device for cooling power electronics
patent, September 1995


Cooling device with heat pipe
patent, July 2000


Heat exchanger
patent, October 2006