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Title: Printed circuit board for integrated LED driver

Abstract

A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices.

Inventors:
; ; ;
Issue Date:
Research Org.:
Lumileds LLC, San Jose, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1497862
Patent Number(s):
10,165,640
Application Number:
15/587,567
Assignee:
Lumileds LLC (San Jose, CA) NETL
DOE Contract Number:  
EE0006703
Resource Type:
Patent
Resource Relation:
Patent File Date: 2012 Dec 19
Country of Publication:
United States
Language:
English

Citation Formats

Song, Zhihua, Soer, Wouter, Bonne, Ron, and Qiu, Yifeng. Printed circuit board for integrated LED driver. United States: N. p., 2018. Web.
Song, Zhihua, Soer, Wouter, Bonne, Ron, & Qiu, Yifeng. Printed circuit board for integrated LED driver. United States.
Song, Zhihua, Soer, Wouter, Bonne, Ron, and Qiu, Yifeng. Tue . "Printed circuit board for integrated LED driver". United States. https://www.osti.gov/servlets/purl/1497862.
@article{osti_1497862,
title = {Printed circuit board for integrated LED driver},
author = {Song, Zhihua and Soer, Wouter and Bonne, Ron and Qiu, Yifeng},
abstractNote = {A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {12}
}

Patent:

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