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Title: System and method for implantable electrical connector

Abstract

A high density electrical connector system is disclosed which may make use of first and second connector components. The first connector component has a first substrate with a first plurality of electrical feedthroughs and at least a first plurality of electrically conductive bond pads in communication with the first plurality of electrical feedthroughs. The second connector component has a second substrate with a second plurality of electrical feedthroughs and at least a second plurality of electrically conductive bond pads in communication with the second plurality of electrical feedthroughs. An electrical coupling subsystem is disposed between the first and second connector components and makes electrical contact between associated pairs of the first and second pluralities of electrically conductive bond pads. A plurality of fasteners may be used for clamping the first and second connector components in facing relationship.

Inventors:
; ;
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1497690
Patent Number(s):
10,149,980
Application Number:
14/748,782
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA) LLNL
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 Jun 24
Country of Publication:
United States
Language:
English

Citation Formats

Shah, Kedar G., Pannu, Satinderpall S., and Patra, Susant. System and method for implantable electrical connector. United States: N. p., 2018. Web.
Shah, Kedar G., Pannu, Satinderpall S., & Patra, Susant. System and method for implantable electrical connector. United States.
Shah, Kedar G., Pannu, Satinderpall S., and Patra, Susant. Tue . "System and method for implantable electrical connector". United States. https://www.osti.gov/servlets/purl/1497690.
@article{osti_1497690,
title = {System and method for implantable electrical connector},
author = {Shah, Kedar G. and Pannu, Satinderpall S. and Patra, Susant},
abstractNote = {A high density electrical connector system is disclosed which may make use of first and second connector components. The first connector component has a first substrate with a first plurality of electrical feedthroughs and at least a first plurality of electrically conductive bond pads in communication with the first plurality of electrical feedthroughs. The second connector component has a second substrate with a second plurality of electrical feedthroughs and at least a second plurality of electrically conductive bond pads in communication with the second plurality of electrical feedthroughs. An electrical coupling subsystem is disposed between the first and second connector components and makes electrical contact between associated pairs of the first and second pluralities of electrically conductive bond pads. A plurality of fasteners may be used for clamping the first and second connector components in facing relationship.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {12}
}

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