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Title: Photoconductive switch package configurations having a profiled resistive element

Abstract

Methods, systems, and devices are disclosed for photoconductive switch package configurations. In some aspects, a photoconductive switch package includes of a wide bandgap photoconductive material (e.g., GaN, ZnO, diamond, AlN, SiC, BN, etc.), a source for energetic photons (e.g., a laser), a mechanism to couple the laser into the switch, and a mechanism for high voltage to enter and leave the switch package. In some implementations, the disclosed photoconductive switch packages can be configured as a three terminal device, e.g., similar to transistors, with one of the terminals being laser input or the voltage input to the laser system.

Inventors:
; ; ; ; ;
Issue Date:
Research Org.:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1496597
Patent Number(s):
10181544
Application Number:
15/204,833
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
Patent Classifications (CPCs):
G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Resource Relation:
Patent File Date: 2016 Jul 07
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Nelson, Scott D., Caporaso, George J., Hawkins, Steven A., Nguyen, Hoang T., Sampayan, Stephen, and Wang, Li-Fang. Photoconductive switch package configurations having a profiled resistive element. United States: N. p., 2019. Web.
Nelson, Scott D., Caporaso, George J., Hawkins, Steven A., Nguyen, Hoang T., Sampayan, Stephen, & Wang, Li-Fang. Photoconductive switch package configurations having a profiled resistive element. United States.
Nelson, Scott D., Caporaso, George J., Hawkins, Steven A., Nguyen, Hoang T., Sampayan, Stephen, and Wang, Li-Fang. Tue . "Photoconductive switch package configurations having a profiled resistive element". United States. https://www.osti.gov/servlets/purl/1496597.
@article{osti_1496597,
title = {Photoconductive switch package configurations having a profiled resistive element},
author = {Nelson, Scott D. and Caporaso, George J. and Hawkins, Steven A. and Nguyen, Hoang T. and Sampayan, Stephen and Wang, Li-Fang},
abstractNote = {Methods, systems, and devices are disclosed for photoconductive switch package configurations. In some aspects, a photoconductive switch package includes of a wide bandgap photoconductive material (e.g., GaN, ZnO, diamond, AlN, SiC, BN, etc.), a source for energetic photons (e.g., a laser), a mechanism to couple the laser into the switch, and a mechanism for high voltage to enter and leave the switch package. In some implementations, the disclosed photoconductive switch packages can be configured as a three terminal device, e.g., similar to transistors, with one of the terminals being laser input or the voltage input to the laser system.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {1}
}

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Electrical Resistances of Thin Metal Films before and after Artificial Aging by Heating
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