Electroplated AU for conformal coating of high aspect ratio silicon structures

Rowen, Adam M.; Grubbs, Robert K.; Coleman, Jonathan Joseph

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Title: Electroplated AU for conformal coating of high aspect ratio silicon structures

Abstract

A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.

Inventors:: Rowen, Adam M.; Grubbs, Robert K.; Coleman, Jonathan Joseph

Issue Date:: 2018-12-04

Research Org.:: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1496220

Patent Number(s):: 10147510

Application Number:: 14/081,342

Assignee:: National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)

Patent Classifications (CPCs):: C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL

C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS

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C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
C23C16/045 - {Coating cavities or hollow spaces, e.g. interior of tubes
C23C16/18 - from metallo-organic compounds
C23C16/45553 - {characterized by the use of precursors specially adapted for ALD}
C23C16/45555 - {applied in non-semiconductor technology}
C23C16/45561 - {Gas plumbing upstream of the reaction chamber}

C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
C25D17/02 - Tanks
C25D3/48 - of gold
C25D5/18 - Electroplating using modulated, pulsed or reversing current
C25D7/123 - {coated first with a seed layer, e.g. for filling vias}

G - PHYSICS G21 - NUCLEAR PHYSICS G21K - TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR
G21K1/025 - {using multiple collimators, e.g. Bucky screens
G21K1/06 - using diffraction, refraction or reflection, e.g. monochromators
G21K2207/005 - Methods and devices obtaining contrast from non-absorbing interaction of the radiation with matter, e.g. phase contrast

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DOE Contract Number:: AC04-94AL85000

Resource Type:: Patent

Resource Relation:: Patent File Date: 2013 Nov 15

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE

Citation Formats


                    Rowen, Adam M., Grubbs, Robert K., and Coleman, Jonathan Joseph. Electroplated AU for conformal coating of high aspect ratio silicon structures.  United States: N. p., 2018. 
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                    Rowen, Adam M., Grubbs, Robert K., & Coleman, Jonathan Joseph. Electroplated AU for conformal coating of high aspect ratio silicon structures.  United States.

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                    Rowen, Adam M., Grubbs, Robert K., and Coleman, Jonathan Joseph. Tue .  
        "Electroplated AU for conformal coating of high aspect ratio silicon structures".  United States.  https://www.osti.gov/servlets/purl/1496220.

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@article{osti_1496220,

  title        = {Electroplated AU for conformal coating of high aspect ratio silicon structures},

  author       = {Rowen, Adam M. and Grubbs, Robert K. and Coleman, Jonathan Joseph},

  abstractNote = {A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2018},

  month        = {12}

}

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Title: Electroplated AU for conformal coating of high aspect ratio silicon structures

Abstract

Citation Formats

Method and apparatus for an improved air gap interconnect structure patent-application, December 2004

Non-Volatile Memory Device and Method for Fabricating Non-Volatile Memory Device patent-application, July 2010

Copper Electroplating on Zero-Thickness ALD Platinum for Nanoscale Computer Chip Interconnects journal, January 2006

Barrier layers patent-application, March 2012

Viscous flow reactor with quartz crystal microbalance for thin film growth by atomic layer deposition journal, August 2002

Anodized electroplated aluminum structures and methods for making the same patent-application, January 2013

Fabrication of diffraction gratings for hard X-ray phase contrast imaging journal, May 2007

Electrical characterization of thin Al2O3 films grown by atomic layer deposition on silicon and various metal substrates journal, June 2002

Hierarchical gold micro-nanostructures based on three-dimensional networks of carbon nanotubes fabricated by using electrochemical deposition journal, April 2012

Forming Through-Substrate Vias by Electrofilling patent-application, April 2012

Methods and Apparatus for Differential Phase-Control Fan Beam CT, Cone-Beam CT and Hybrid Cone-Beam CT patent-application, September 2010

Light emitting diode with conducting metal substrate patent-application, July 2006

Nano-structured photovoltaic solar cell and related methods patent-application, February 2007

Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse plating patent, April 2001

Pt–Al2O3 dual layer atomic layer deposition coating in high aspect ratio nanopores journal, December 2012

Apparatus and method for highly controlled electrodeposition patent-application, December 2004

Device fabricated using an electroplating process patent, December 2012

Electroplating method and article made by same patent-application, June 2013

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Method and apparatus for an improved air gap interconnect structure
patent-application, December 2004

Non-Volatile Memory Device and Method for Fabricating Non-Volatile Memory Device
patent-application, July 2010

Copper Electroplating on Zero-Thickness ALD Platinum for Nanoscale Computer Chip Interconnects
journal, January 2006

Barrier layers
patent-application, March 2012

Viscous flow reactor with quartz crystal microbalance for thin film growth by atomic layer deposition
journal, August 2002

Anodized electroplated aluminum structures and methods for making the same
patent-application, January 2013

Fabrication of diffraction gratings for hard X-ray phase contrast imaging
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Electrical characterization of thin Al₂O₃ films grown by atomic layer deposition on silicon and various metal substrates
journal, June 2002

Hierarchical gold micro-nanostructures based on three-dimensional networks of carbon nanotubes fabricated by using electrochemical deposition
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Forming Through-Substrate Vias by Electrofilling
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Methods and Apparatus for Differential Phase-Control Fan Beam CT, Cone-Beam CT and Hybrid Cone-Beam CT
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Light emitting diode with conducting metal substrate
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Nano-structured photovoltaic solar cell and related methods
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Pt–Al₂O₃ dual layer atomic layer deposition coating in high aspect ratio nanopores
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Apparatus and method for highly controlled electrodeposition
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