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Title: Electroplated AU for conformal coating of high aspect ratio silicon structures

Abstract

A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.

Inventors:
; ;
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1496220
Patent Number(s):
10,147,510
Application Number:
14/081,342
Assignee:
National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM) SNL
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 2013 Nov 15
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Rowen, Adam M., Grubbs, Robert K., and Coleman, Jonathan Joseph. Electroplated AU for conformal coating of high aspect ratio silicon structures. United States: N. p., 2018. Web.
Rowen, Adam M., Grubbs, Robert K., & Coleman, Jonathan Joseph. Electroplated AU for conformal coating of high aspect ratio silicon structures. United States.
Rowen, Adam M., Grubbs, Robert K., and Coleman, Jonathan Joseph. Tue . "Electroplated AU for conformal coating of high aspect ratio silicon structures". United States. https://www.osti.gov/servlets/purl/1496220.
@article{osti_1496220,
title = {Electroplated AU for conformal coating of high aspect ratio silicon structures},
author = {Rowen, Adam M. and Grubbs, Robert K. and Coleman, Jonathan Joseph},
abstractNote = {A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {12}
}

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Works referenced in this record:

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