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Title: Silicone elastomers capable of large isotropic dimensional change

Abstract

Described herein is a highly effective route towards the controlled and isotropic reduction in size-scale, of complex 3D structures using silicone network polymer chemistry. In particular, a class of silicone structures were developed that once patterned and cured can `shrink` micron scale additive manufactured and lithographically patterned structures by as much as 1 order of magnitude while preserving the dimensions and integrity of these parts. This class of silicone materials is compatible with existing additive manufacture and soft lithographic fabrication processes and will allow access to a hitherto unobtainable dimensionality of fabrication.

Inventors:
;
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1495338
Patent Number(s):
10,138,330
Application Number:
15/584,711
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Resource Relation:
Patent File Date: 2017 May 02
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Lewicki, James, and Worsley, Marcus A. Silicone elastomers capable of large isotropic dimensional change. United States: N. p., 2018. Web.
Lewicki, James, & Worsley, Marcus A. Silicone elastomers capable of large isotropic dimensional change. United States.
Lewicki, James, and Worsley, Marcus A. Tue . "Silicone elastomers capable of large isotropic dimensional change". United States. https://www.osti.gov/servlets/purl/1495338.
@article{osti_1495338,
title = {Silicone elastomers capable of large isotropic dimensional change},
author = {Lewicki, James and Worsley, Marcus A.},
abstractNote = {Described herein is a highly effective route towards the controlled and isotropic reduction in size-scale, of complex 3D structures using silicone network polymer chemistry. In particular, a class of silicone structures were developed that once patterned and cured can `shrink` micron scale additive manufactured and lithographically patterned structures by as much as 1 order of magnitude while preserving the dimensions and integrity of these parts. This class of silicone materials is compatible with existing additive manufacture and soft lithographic fabrication processes and will allow access to a hitherto unobtainable dimensionality of fabrication.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {11}
}

Patent:

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