Vertically integrated optoelectronics package for MEMS devices
Abstract
The present application relates to vertically integrated assemblies including a MEMS-based optomechanical architecture. In some embodiments, the assembly includes a MEMS/optoelectronic module, an emitter module, and a detector module, where these modules are vertically integrated. Methods of fabricating such assemblies are also described herein.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1495213
- Patent Number(s):
- 10139564
- Application Number:
- 15/009,153
- Assignee:
- National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
- Patent Classifications (CPCs):
-
G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01S - DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2016 Jan 28
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Homeijer, Brian D., and Eichenfield, Matt. Vertically integrated optoelectronics package for MEMS devices. United States: N. p., 2018.
Web.
Homeijer, Brian D., & Eichenfield, Matt. Vertically integrated optoelectronics package for MEMS devices. United States.
Homeijer, Brian D., and Eichenfield, Matt. Tue .
"Vertically integrated optoelectronics package for MEMS devices". United States. https://www.osti.gov/servlets/purl/1495213.
@article{osti_1495213,
title = {Vertically integrated optoelectronics package for MEMS devices},
author = {Homeijer, Brian D. and Eichenfield, Matt},
abstractNote = {The present application relates to vertically integrated assemblies including a MEMS-based optomechanical architecture. In some embodiments, the assembly includes a MEMS/optoelectronic module, an emitter module, and a detector module, where these modules are vertically integrated. Methods of fabricating such assemblies are also described herein.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {11}
}
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