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Title: Vertically integrated optoelectronics package for MEMS devices

Abstract

The present application relates to vertically integrated assemblies including a MEMS-based optomechanical architecture. In some embodiments, the assembly includes a MEMS/optoelectronic module, an emitter module, and a detector module, where these modules are vertically integrated. Methods of fabricating such assemblies are also described herein.

Inventors:
;
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1495213
Patent Number(s):
10139564
Application Number:
15/009,153
Assignee:
National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
Patent Classifications (CPCs):
G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01S - DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 2016 Jan 28
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Homeijer, Brian D., and Eichenfield, Matt. Vertically integrated optoelectronics package for MEMS devices. United States: N. p., 2018. Web.
Homeijer, Brian D., & Eichenfield, Matt. Vertically integrated optoelectronics package for MEMS devices. United States.
Homeijer, Brian D., and Eichenfield, Matt. Tue . "Vertically integrated optoelectronics package for MEMS devices". United States. https://www.osti.gov/servlets/purl/1495213.
@article{osti_1495213,
title = {Vertically integrated optoelectronics package for MEMS devices},
author = {Homeijer, Brian D. and Eichenfield, Matt},
abstractNote = {The present application relates to vertically integrated assemblies including a MEMS-based optomechanical architecture. In some embodiments, the assembly includes a MEMS/optoelectronic module, an emitter module, and a detector module, where these modules are vertically integrated. Methods of fabricating such assemblies are also described herein.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {11}
}

Works referenced in this record:

A high-resolution microchip optomechanical accelerometer
journal, October 2012


The Development of Micromachined Gyroscope Structure and Circuitry Technology
journal, January 2014


Three-phase capacitive position sensing
conference, November 2010


Inertial measurement unit using rotatable MEMS sensors
patent, May 2007


Methods of forming capacitive sensors
patent, July 2014


Micro-electro-mechanical sensor with force feedback loop
patent, October 2007


Efficient semiconductor light-emitting device and method
patent, February 1996


VCSELs for atomic clocks
conference, February 2006


Microelectromechanical inertial sensor
patent, June 2012


An ultra-low noise MEMS accelerometer for seismic imaging
conference, October 2011


Micromachined force-balance feedback accelerometer with optical displacement detection
patent, July 2014


Micromachined inertial sensors
journal, January 1998


Dual-axis resonator gyroscope
patent, January 2012


A lateral-axis micromachined tuning fork gyroscope with torsional Z -sensing and electrostatic force-balanced driving
journal, December 2009


Control design for force balance sensors
conference, June 2009


A picogram- and nanometre-scale photonic-crystal optomechanical cavity
journal, May 2009


Dispersion properties of photonic crystal waveguides with a low in-plane index contrast
journal, September 2006


Characterization and Production Control for drie of mems Accelerometers Using Optical Displacement Transducer Measurements
conference, May 2012


Type I and Type II Micromachined Vibratory Gyroscopes
conference, January 2006


Microelectromechanical acceleration-sensing apparatus
patent, December 2006


High density laser optics
patent, April 2015


Optically transduced MEMS gyro device
patent, May 2014


Coherent mixing of mechanical excitations in nano-optomechanical structures
journal, February 2010


Micro-G silicon accelerometer using surface electrodes
conference, October 2009


Design and Simulation of MEMS Based Tuning Fork Micro-Gyroscope
journal, October 2011


Optical and mechanical design of a “zipper” photonic crystal optomechanical cavity
journal, January 2009


A novel tri-axis MEMS gyroscope with in-plane tetra-pendulum proof masses and enhanced sensitive springs
journal, March 2014


Ultra-low crosstalk, CMOS compatible waveguide crossings for densely integrated photonic interconnection networks
journal, January 2013


Optomechanical crystals
journal, October 2009


Integrated resonant micro-optical gyroscope and method of fabrication
patent, September 2006


Chip-Scale Cavity-Optomechanical Accelerometer
conference, January 2013


A 3-axis force balanced accelerometer using a single proof-mass
conference, January 1997


Inertial measurement unit using rotatable MEMS sensors
patent, June 2006


Electromagnetically induced transparency and slow light with optomechanics
journal, March 2011


Demonstration of high waveguide bending efficiency (>90%) in a photonic-crystal slab at 1.5-μm wavelengths
conference, July 2001


Microscale autonomous sensor and communications module
patent, March 2014


Slot-mode-coupled optomechanical crystals
journal, January 2012


Hewlett packard's seismic grade MEMS accelerometer
conference, January 2011


ARS-12G inertial angular vibration sensor provides nanoradian measurement
conference, August 2001


Error Sources in In-Plane Silicon Tuning-Fork MEMS Gyroscopes
journal, June 2006


VCSELs for atomic sensors
conference, February 2007


Optical displacement sensor
patent, April 2008


Gyroscopes using surface electrodes
patent, September 2012


Three-dimensional control of light in a two-dimensional photonic crystal slab
journal, October 2000