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Title: Vertically integrated optoelectronics package for MEMS devices

Abstract

The present application relates to vertically integrated assemblies including a MEMS-based optomechanical architecture. In some embodiments, the assembly includes a MEMS/optoelectronic module, an emitter module, and a detector module, where these modules are vertically integrated. Methods of fabricating such assemblies are also described herein.

Inventors:
;
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1495213
Patent Number(s):
10139564
Application Number:
15/009,153
Assignee:
National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01S - DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT
G - PHYSICS G02 - OPTICS G02B - OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 2016 Jan 28
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Homeijer, Brian D., and Eichenfield, Matt. Vertically integrated optoelectronics package for MEMS devices. United States: N. p., 2018. Web.
Homeijer, Brian D., & Eichenfield, Matt. Vertically integrated optoelectronics package for MEMS devices. United States.
Homeijer, Brian D., and Eichenfield, Matt. Tue . "Vertically integrated optoelectronics package for MEMS devices". United States. https://www.osti.gov/servlets/purl/1495213.
@article{osti_1495213,
title = {Vertically integrated optoelectronics package for MEMS devices},
author = {Homeijer, Brian D. and Eichenfield, Matt},
abstractNote = {The present application relates to vertically integrated assemblies including a MEMS-based optomechanical architecture. In some embodiments, the assembly includes a MEMS/optoelectronic module, an emitter module, and a detector module, where these modules are vertically integrated. Methods of fabricating such assemblies are also described herein.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {11}
}

Patent:

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