Wound/stacked ceramic film capacitors, method for making ceramic film capacitors
Abstract
The invention provides a process for making ceramic film capacitors, the process comprising supplying a flexible substrate, depositing a first electrode on a first region of the flexible substrate, wherein the first electrode defines a first thickness, overlaying the first electrode with a dielectric film; and depositing a second electrode on the ceramic film, wherein the second electrode defines a second thickness. Also provided is a capacitor comprising flexible substrate, a first electrode deposited on said flexible substrate, a dielectric overlaying the first electrode; and a second electrode deposited on said dielectric.
- Inventors:
- Issue Date:
- Research Org.:
- Argonne National Laboratory (ANL), Argonne, IL (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1493601
- Patent Number(s):
- 10128046
- Application Number:
- 14/731,738
- Assignee:
- UCHICAGO ARGONNE, LLC (Chicago, IL)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01G - CAPACITORS
- DOE Contract Number:
- AC02-06CH11357
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2015 Jun 05
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Ma, Beihai, Balachandran, Uthamalingam, Dorris, Stephen E., and Lee, Tae H. Wound/stacked ceramic film capacitors, method for making ceramic film capacitors. United States: N. p., 2018.
Web.
Ma, Beihai, Balachandran, Uthamalingam, Dorris, Stephen E., & Lee, Tae H. Wound/stacked ceramic film capacitors, method for making ceramic film capacitors. United States.
Ma, Beihai, Balachandran, Uthamalingam, Dorris, Stephen E., and Lee, Tae H. Tue .
"Wound/stacked ceramic film capacitors, method for making ceramic film capacitors". United States. https://www.osti.gov/servlets/purl/1493601.
@article{osti_1493601,
title = {Wound/stacked ceramic film capacitors, method for making ceramic film capacitors},
author = {Ma, Beihai and Balachandran, Uthamalingam and Dorris, Stephen E. and Lee, Tae H.},
abstractNote = {The invention provides a process for making ceramic film capacitors, the process comprising supplying a flexible substrate, depositing a first electrode on a first region of the flexible substrate, wherein the first electrode defines a first thickness, overlaying the first electrode with a dielectric film; and depositing a second electrode on the ceramic film, wherein the second electrode defines a second thickness. Also provided is a capacitor comprising flexible substrate, a first electrode deposited on said flexible substrate, a dielectric overlaying the first electrode; and a second electrode deposited on said dielectric.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {11}
}
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Works referenced in this record:
Metallized film capacitor
patent, May 1999
- Okuno, Shigeo; Nishimori, Toshiyuki; Okabe, Shigeo
- US Patent Document 5,905,628