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Title: Wound/stacked ceramic film capacitors, method for making ceramic film capacitors

Abstract

The invention provides a process for making ceramic film capacitors, the process comprising supplying a flexible substrate, depositing a first electrode on a first region of the flexible substrate, wherein the first electrode defines a first thickness, overlaying the first electrode with a dielectric film; and depositing a second electrode on the ceramic film, wherein the second electrode defines a second thickness. Also provided is a capacitor comprising flexible substrate, a first electrode deposited on said flexible substrate, a dielectric overlaying the first electrode; and a second electrode deposited on said dielectric.

Inventors:
; ; ;
Issue Date:
Research Org.:
Argonne National Laboratory (ANL), Argonne, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1493601
Patent Number(s):
10128046
Application Number:
14/731,738
Assignee:
UCHICAGO ARGONNE, LLC (Chicago, IL)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01G - CAPACITORS
DOE Contract Number:  
AC02-06CH11357
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 Jun 05
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Ma, Beihai, Balachandran, Uthamalingam, Dorris, Stephen E., and Lee, Tae H.. Wound/stacked ceramic film capacitors, method for making ceramic film capacitors. United States: N. p., 2018. Web.
Ma, Beihai, Balachandran, Uthamalingam, Dorris, Stephen E., & Lee, Tae H.. Wound/stacked ceramic film capacitors, method for making ceramic film capacitors. United States.
Ma, Beihai, Balachandran, Uthamalingam, Dorris, Stephen E., and Lee, Tae H.. Tue . "Wound/stacked ceramic film capacitors, method for making ceramic film capacitors". United States. https://www.osti.gov/servlets/purl/1493601.
@article{osti_1493601,
title = {Wound/stacked ceramic film capacitors, method for making ceramic film capacitors},
author = {Ma, Beihai and Balachandran, Uthamalingam and Dorris, Stephen E. and Lee, Tae H.},
abstractNote = {The invention provides a process for making ceramic film capacitors, the process comprising supplying a flexible substrate, depositing a first electrode on a first region of the flexible substrate, wherein the first electrode defines a first thickness, overlaying the first electrode with a dielectric film; and depositing a second electrode on the ceramic film, wherein the second electrode defines a second thickness. Also provided is a capacitor comprising flexible substrate, a first electrode deposited on said flexible substrate, a dielectric overlaying the first electrode; and a second electrode deposited on said dielectric.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {11}
}

Works referenced in this record:

Metallized film capacitor
patent, May 1999