Global to push GA events into
skip to main content

Title: Reversible adhesive compositions and related methods

The disclosure relates to reversible bonded structural joints using active adhesive compositions that can allow for dis-assembly, repair, and re-assembly. The disclosure is particularly directed to the adhesive composition material, irrespective of the type of the substrate(s) being joined. The adhesive composition can include any thermoplastic adhesive material that can be remotely activated for targeted heating of just the adhesive composition (e.g., and not the surrounding substrates being joined) via the inclusion of electromagnetically excitable particles in the adhesive composition. The substrates can be any metal material, any composite material, any hybrid material, or otherwise. The disclosed adhesive compositions allow for recyclability of parts at the end of their lifetime and repair/replacement of parts during their lifetime.
Inventors:
; ;
Issue Date:
OSTI Identifier:
1489783
Assignee:
Board of Trustees of Michigan State University (East Lansing, MI) DOEEE
Patent Number(s):
10,099,458
Application Number:
15/078,333
Contract Number:
EE0006424
Resource Relation:
Patent File Date: 2016 Mar 23
Research Org:
Board of Trustees of Michigan State University, East Lansing, MI (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 42 ENGINEERING