Title: Rapid prototype extruded conductive pathways

Abstract

A process of producing electrically conductive pathways within additively manufactured parts and similar parts made by plastic extrusion nozzles. The process allows for a three-dimensional part having both conductive and non-conductive portions and allows for such parts to be manufactured in a single production step.

Inventors:

Bobbitt, III, John Thomas

Issue Date:

2018-09-18

Research Org.:

Cree, Inc., Durham, NC (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1480305

Patent Number(s):

10085348

Application Number:

15/187,836

Assignee:

SAVANNAH RIVER NUCLEAR SOLUTIONS, LLC (Aiken, SC)

Patent Classifications (CPCs):

B - PERFORMING OPERATIONS B33 - ADDITIVE MANUFACTURING TECHNOLOGY B33Y - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

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B - PERFORMING OPERATIONS B33 - ADDITIVE MANUFACTURING TECHNOLOGY B33Y - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING

B33Y80/00 - Products made by additive manufacturing

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10S977/734 - Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K3/10 - in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01R - ELECTRICALLY-CONDUCTIVE CONNECTIONS

H01R43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors

B - PERFORMING OPERATIONS B82 - NANOTECHNOLOGY B82Y - SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES

B82Y30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites

B - PERFORMING OPERATIONS B29 - WORKING OF PLASTICS B29C - SHAPING OR JOINING OF PLASTICS

B29C70/885 - {with incorporated metallic wires, nets, films or plates

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K1/0284 - {Details of three-dimensional rigid printed circuit boards

B - PERFORMING OPERATIONS B29 - WORKING OF PLASTICS B29C - SHAPING OR JOINING OF PLASTICS

B29C64/165 - using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber

B - PERFORMING OPERATIONS B33 - ADDITIVE MANUFACTURING TECHNOLOGY B33Y - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING

B33Y40/00 - Auxiliary operations or equipment, e.g. for material handling

B - PERFORMING OPERATIONS B29 - WORKING OF PLASTICS B29C - SHAPING OR JOINING OF PLASTICS

B29C64/112 - using individual droplets, e.g. from jetting heads

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K3/0014 - {Shaping of the substrate, e.g. by moulding}
H05K2203/013 - Inkjet printing, e.g. for printing insulating material or resist
H05K3/12 - using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}
H05K3/125 - {by ink-jet printing}

B - PERFORMING OPERATIONS B29 - WORKING OF PLASTICS B29C - SHAPING OR JOINING OF PLASTICS

B29C64/135 - the energy source being concentrated, e.g. scanning lasers or focused light sources

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10S977/742 - Carbon nanotubes, CNTs

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K3/22 - Secondary treatment of printed circuits {
H05K3/14 - using spraying techniques to apply the conductive material {, e.g. vapour evaporation}
H05K1/09 - Use of materials for the {conductive, e.g. } metallic pattern
H05K2203/107 - Using laser light

B - PERFORMING OPERATIONS B29 - WORKING OF PLASTICS B29C - SHAPING OR JOINING OF PLASTICS

B29C64/153 - using layers of powder being selectively joined, e.g. by selective laser sintering or melting
B29C64/124 - using layers of liquid which are selectively solidified

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DOE Contract Number:  

AC09-08SR22470

Resource Type:

Patent

Resource Relation:

Patent File Date: 2016 Jun 21

Country of Publication:

United States

Language:

English