Photocathode and method for assembly
Abstract
Technologies are described for methods for fabricating a film component. The methods may comprise sputtering a first film onto a substrate. The first film may include a semiconductor compound material. The semiconductor compound material may include a semi-metal material and one or more alkali material. The methods may further comprise evaporating a second film onto the first film. The second film may include the one or more alkali materials. The one or more alkali materials may catalyze crystallization of the semiconductor compound material in the first film substantially throughout the first film to form the film component in the first layer.
- Inventors:
- Issue Date:
- Research Org.:
- Brookhaven National Laboratory (BNL), Upton, NY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1469695
- Patent Number(s):
- 10049848
- Application Number:
- 15/179,091
- Assignee:
- Brookhaven Science Associates, LLC (Upton, NY); The Regents of the University of California (Oakland, CA)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01J - ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- DOE Contract Number:
- SC0012704; AC02-05CH11231
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2016 Jun 10
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Smedley, John, Attenkofer, Klaus, Schubert, Susanne, Gaowei, Mengjia, and Walsh, John. Photocathode and method for assembly. United States: N. p., 2018.
Web.
Smedley, John, Attenkofer, Klaus, Schubert, Susanne, Gaowei, Mengjia, & Walsh, John. Photocathode and method for assembly. United States.
Smedley, John, Attenkofer, Klaus, Schubert, Susanne, Gaowei, Mengjia, and Walsh, John. Tue .
"Photocathode and method for assembly". United States. https://www.osti.gov/servlets/purl/1469695.
@article{osti_1469695,
title = {Photocathode and method for assembly},
author = {Smedley, John and Attenkofer, Klaus and Schubert, Susanne and Gaowei, Mengjia and Walsh, John},
abstractNote = {Technologies are described for methods for fabricating a film component. The methods may comprise sputtering a first film onto a substrate. The first film may include a semiconductor compound material. The semiconductor compound material may include a semi-metal material and one or more alkali material. The methods may further comprise evaporating a second film onto the first film. The second film may include the one or more alkali materials. The one or more alkali materials may catalyze crystallization of the semiconductor compound material in the first film substantially throughout the first film to form the film component in the first layer.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {8}
}
Works referenced in this record:
Effect of Sb thickness on the performance of bialkali-antimonide photocathodes
journal, March 2016
- Mamun, Md Abdullah A.; Elmustafa, Abdelmageed A.; Hernandez-Garcia, Carlos
- Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 34, Issue 2, Article No. 021509