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Title: High temperature vibration resistant solderless electrical connections for planar surfaces

An electrical arrangement (10), including: a first conductor (12) having a first generally planar contact area (34); a second conductor (12) having a second generally planar contact area (40); an intermediate conductor (44) having a first faying area (84) overlying the first contact area and a second faying area (86) overlying the second contact area; a compression arrangement configured to compress the first faying area and the first contact area toward each other and to compress the second faying area and the second contact area toward each other; and a dimpling structure (46) effective to create plural contact points (74) between the first faying area and the first contact area and between the second faying area and the second contact area when the first and the second faying areas and the first and second contact areas are compressed toward each other by the compression arrangement.
Inventors:
Issue Date:
OSTI Identifier:
1469691
Assignee:
SIEMENS ENERGY, INC. (Orlando, FL) NETL
Patent Number(s):
10,051,719
Application Number:
14/576,365
Contract Number:
FE0005666
Resource Relation:
Patent File Date: 2014 Dec 19
Research Org:
Siemens Energy, Inc., Orlando, FL (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English