Energetic potting materials, electronic devices potted with the energetic potting materials, and related methods

Title: Energetic potting materials, electronic devices potted with the energetic potting materials, and related methods

Abstract

A potted electronic device comprises an electronic device at least partially encapsulated by an energetic potting material. The energetic potting material comprises a halogenated urethane binder and a metal fuel dispersed within the halogenated urethane binder. Related energetic potting materials and methods of forming electronic devices at least partially encapsulated with the energetic potting materials are also disclosed.

Inventors:: Rasmussen, Nikki; Condit, Reston A.

Issue Date:: 2018-08-07

Research Org.:: Idaho National Lab. (INL), Idaho Falls, ID (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1469299

Patent Number(s):: 10042397

Application Number:: 15/046,979

Assignee:: BATTELLE ENERGY ALLIANCE, LLC. (Idaho Falls, ID)

Patent Classifications (CPCs):: C - CHEMISTRY C06 - EXPLOSIVES C06B - EXPLOSIVES OR THERMIC COMPOSITIONS

G - PHYSICS G06 - COMPUTING G06F - ELECTRIC DIGITAL DATA PROCESSING

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C - CHEMISTRY C06 - EXPLOSIVES C06B - EXPLOSIVES OR THERMIC COMPOSITIONS
C06B43/00 - Compositions characterised by explosive or thermic constituents not provided for in groups C06B25/00 - C06B41/00

G - PHYSICS G06 - COMPUTING G06F - ELECTRIC DIGITAL DATA PROCESSING
G06F21/86 - Secure or tamper-resistant housings
G06F2221/2143 - Clearing memory, e.g. to prevent the data from being stolen

C - CHEMISTRY C06 - EXPLOSIVES C06B - EXPLOSIVES OR THERMIC COMPOSITIONS
C06B27/00 - Compositions containing a metal, boron, silicon, selenium or tellurium or mixtures, intercompounds or hydrides thereof, and hydrocarbons or halogenated hydrocarbons

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K5/0208 - {Interlock mechanisms
H05K3/285 - {Permanent coating compositions}

G - PHYSICS G06 - COMPUTING G06F - ELECTRIC DIGITAL DATA PROCESSING
G06F1/182 - {with special features, e.g. for use in industrial environments

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K2203/1316 - Moulded encapsulation of mounted components
H05K3/284 - {for encapsulating mounted components

C - CHEMISTRY C06 - EXPLOSIVES C06B - EXPLOSIVES OR THERMIC COMPOSITIONS
C06B45/105 - {The resin being a polymer bearing energetic groups or containing a soluble organic explosive}
C06B45/18 - comprising a coated component

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DOE Contract Number:: AC07-05ID14517

Resource Type:: Patent

Resource Relation:: Patent File Date: 2016 Feb 18

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE

Citation Formats


                    Rasmussen, Nikki, and Condit, Reston A. Energetic potting materials, electronic devices potted with the energetic potting materials, and related methods.  United States: N. p., 2018. 
        Web.

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                    Rasmussen, Nikki, & Condit, Reston A. Energetic potting materials, electronic devices potted with the energetic potting materials, and related methods.  United States.

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                    Rasmussen, Nikki, and Condit, Reston A. Tue .  
        "Energetic potting materials, electronic devices potted with the energetic potting materials, and related methods".  United States.  https://www.osti.gov/servlets/purl/1469299.

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@article{osti_1469299,

  title        = {Energetic potting materials, electronic devices potted with the energetic potting materials, and related methods},

  author       = {Rasmussen, Nikki and Condit, Reston A.},

  abstractNote = {A potted electronic device comprises an electronic device at least partially encapsulated by an energetic potting material. The energetic potting material comprises a halogenated urethane binder and a metal fuel dispersed within the halogenated urethane binder. Related energetic potting materials and methods of forming electronic devices at least partially encapsulated with the energetic potting materials are also disclosed.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2018},

  month        = {8}

}

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Similar Records

Title: Energetic potting materials, electronic devices potted with the energetic potting materials, and related methods

Abstract

Citation Formats

Encapsulating method of substrate based electronic device patent, October 1999

Preparation and characterization of polyurethanes based on a series of fluorinated diols journal, September 1993

Circuit board, mounting structure of ball grid array, electro-optic device and electronic device patent, September 2007

Deflagrative electronic component potting compound patent, July 1978

Method for seal molding electronic components with resin patent, April 1993

Method for encapsulating an electrochemical sensor patent, September 1997

Bridge igniter patent, November 2004

Pyrotechnic thermite composition patent, December 2009

Synthesis of fluorinated urethane acrylate based UV-curable coatings journal, February 2013

Hot wire igniter patent, February 2008

Electrical connector having an improved magnetic module patent, August 2010

Layout method for printed circuit board patent, October 2015

Insulated surface mount circuit board construction patent, February 2000

Multi-layer printed circuit board structure, connector module and memory storage device patent, October 2015

Encapsulating method of substrate based electronic device
patent, October 1999

Preparation and characterization of polyurethanes based on a series of fluorinated diols
journal, September 1993

Circuit board, mounting structure of ball grid array, electro-optic device and electronic device
patent, September 2007

Deflagrative electronic component potting compound
patent, July 1978

Method for seal molding electronic components with resin
patent, April 1993

Method for encapsulating an electrochemical sensor
patent, September 1997

Bridge igniter
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Pyrotechnic thermite composition
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Synthesis of fluorinated urethane acrylate based UV-curable coatings
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patent, February 2000

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patent, October 2015