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Title: Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.
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Issue Date:
OSTI Identifier:
International Business Machines Corporation (Armonk, NY) DOEEE
Patent Number(s):
Application Number:
Contract Number:
Resource Relation:
Patent File Date: 2014 Dec 08
Research Org:
International Business Machines Corporation, Armonk, NY (United States)
Sponsoring Org:
Country of Publication:
United States