Electromagnetic isolation structure

Rodenbeck, Christopher T.; Peterson, Kenneth A.

Title: Electromagnetic isolation structure

Abstract

The various technologies presented herein relate to isolating an integrated circuit from electromagnetic radiation/interference. The integrated circuit can be encapsulated in a coating (e.g., a conformal coating). A conductive layer can be formed over the coating, where the conductive layer is deposited to connect with an electromagnetic shielding layer included in a substrate upon which the integrated circuit is located thereby forming a Faraday cage around the integrated circuit. Hollow spheres can be included in the coating to improve the dielectric constant of the coating. The conductive layer can be formed from at least one of metallic material or a polymer coating which includes conductive material. The integrated circuit can be utilized in conjunction with a heat sink and further, the integrated circuit can be of a flip chip configuration.

Inventors:: Rodenbeck, Christopher T.; Peterson, Kenneth A.

Issue Date:: 2018-07-17

Research Org.:: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1464509

Patent Number(s):: 10026701

Application Number:: 14/444,867

Assignee:: National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L2924/10253 - Silicon [Si]
H01L24/16 - {of an individual bump connector}
H01L2924/16195 - Flat cap [not enclosing an internal cavity]
H01L2224/8192 - Applying permanent coating, e.g. protective coating
H01L2223/6616 - Vertical connections, e.g. vias
H01L23/3135 - {Double encapsulation or coating and encapsulation}
H01L2224/48091 - Arched
H01L2224/8592 - Applying permanent coating, e.g. protective coating
H01L2924/3025 - Electromagnetic shielding
H01L2224/32245 - the item being metallic
H01L2224/73204 - the bump connector being embedded into the layer connector
H01L2224/45124 - Aluminium
H01L23/3121 - {a substrate forming part of the encapsulation}
H01L2924/1421 - RF devices
H01L24/45 - {of an individual wire connector}
H01L2224/48227 - connecting the wire to a bond pad of the item
H01L21/563 - {Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate}
H01L2224/73265 - Layer and wire connectors
H01L2224/16227 - the bump connector connecting to a bond pad of the item
H01L24/48 - {of an individual wire connector}
H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
H01L2224/45147 - Copper
H01L24/73 - {Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71}
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L24/32 - {of an individual layer connector}
H01L23/552 - Protection against radiation, e.g. light {or electromagnetic waves}
H01L2924/15153 - the die mounting substrate comprising a recess for hosting the device
H01L2924/00012 - Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
H01L2924/10329 - Gallium arsenide [GaAs]
H01L2224/16225 - the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L2224/45144 - Gold
H01L2224/32225 - the item being non-metallic, e.g. insulating substrate with or without metallisation

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DOE Contract Number:: AC04-94AL85000

Resource Type:: Patent

Resource Relation:: Patent File Date: 2014 Jul 28

Country of Publication:: United States

Language:: English

Citation Formats


                    Rodenbeck, Christopher T., and Peterson, Kenneth A. Electromagnetic isolation structure.  United States: N. p., 2018. 
        Web.

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                    Rodenbeck, Christopher T., & Peterson, Kenneth A. Electromagnetic isolation structure.  United States.

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                    Rodenbeck, Christopher T., and Peterson, Kenneth A. Tue .  
        "Electromagnetic isolation structure".  United States.  https://www.osti.gov/servlets/purl/1464509.

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@article{osti_1464509,

  title        = {Electromagnetic isolation structure},

  author       = {Rodenbeck, Christopher T. and Peterson, Kenneth A.},

  abstractNote = {The various technologies presented herein relate to isolating an integrated circuit from electromagnetic radiation/interference. The integrated circuit can be encapsulated in a coating (e.g., a conformal coating). A conductive layer can be formed over the coating, where the conductive layer is deposited to connect with an electromagnetic shielding layer included in a substrate upon which the integrated circuit is located thereby forming a Faraday cage around the integrated circuit. Hollow spheres can be included in the coating to improve the dielectric constant of the coating. The conductive layer can be formed from at least one of metallic material or a polymer coating which includes conductive material. The integrated circuit can be utilized in conjunction with a heat sink and further, the integrated circuit can be of a flip chip configuration.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2018},

  month        = {7}

}

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Works referenced in this record:

Electrooptic Inspection of Vector Leakage in Radiofrequency Multichip Modules
journal, December 2013

Rodenbeck, Christopher T.; Peterson, Kenneth A.; Sandoval, Charles E.
IEEE Transactions on Electromagnetic Compatibility, Vol. 55, Issue 6
https://doi.org/10.1109/TEMC.2013.2265049

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Title: Electromagnetic isolation structure

Abstract

Citation Formats

Electrooptic Inspection of Vector Leakage in Radiofrequency Multichip Modules journal, December 2013

Electrooptic Inspection of Vector Leakage in Radiofrequency Multichip Modules
journal, December 2013