Electromagnetic isolation structure
Abstract
The various technologies presented herein relate to isolating an integrated circuit from electromagnetic radiation/interference. The integrated circuit can be encapsulated in a coating (e.g., a conformal coating). A conductive layer can be formed over the coating, where the conductive layer is deposited to connect with an electromagnetic shielding layer included in a substrate upon which the integrated circuit is located thereby forming a Faraday cage around the integrated circuit. Hollow spheres can be included in the coating to improve the dielectric constant of the coating. The conductive layer can be formed from at least one of metallic material or a polymer coating which includes conductive material. The integrated circuit can be utilized in conjunction with a heat sink and further, the integrated circuit can be of a flip chip configuration.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1464509
- Patent Number(s):
- 10,026,701
- Application Number:
- 14/444,867
- Assignee:
- National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2014 Jul 28
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Rodenbeck, Christopher T., and Peterson, Kenneth A. Electromagnetic isolation structure. United States: N. p., 2018.
Web.
Rodenbeck, Christopher T., & Peterson, Kenneth A. Electromagnetic isolation structure. United States.
Rodenbeck, Christopher T., and Peterson, Kenneth A. Tue .
"Electromagnetic isolation structure". United States. https://www.osti.gov/servlets/purl/1464509.
@article{osti_1464509,
title = {Electromagnetic isolation structure},
author = {Rodenbeck, Christopher T. and Peterson, Kenneth A.},
abstractNote = {The various technologies presented herein relate to isolating an integrated circuit from electromagnetic radiation/interference. The integrated circuit can be encapsulated in a coating (e.g., a conformal coating). A conductive layer can be formed over the coating, where the conductive layer is deposited to connect with an electromagnetic shielding layer included in a substrate upon which the integrated circuit is located thereby forming a Faraday cage around the integrated circuit. Hollow spheres can be included in the coating to improve the dielectric constant of the coating. The conductive layer can be formed from at least one of metallic material or a polymer coating which includes conductive material. The integrated circuit can be utilized in conjunction with a heat sink and further, the integrated circuit can be of a flip chip configuration.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {7}
}
Works referenced in this record:
Ultrahigh-frequency electronic component
patent, March 1999
- Ichikawa, Seiji; Hirokawa, Tomoaki; Kimura, Tomoaki
- US Patent Document 5,889,232
Semiconductor component with electromagnetic shielding device
patent, March 2006
- Bauer, Michael; Birzer, Christian; Ernst, Georg
- US Patent Document 7,009,288
Semiconductor device and manufacturing method of the same
patent, July 2013
- Moriya;, Susumu
- US Patent Document 8,497,156