System and method for neural interface with modular active electronics
Abstract
A modular, high density electrical system is disclosed which makes use of an interface component, which is well suited to being placed in contact with an anatomy of either a human or an animal, and which may be releasably coupled to an electronics module subsystem. The interface component has a plurality of electrically conductive interconnect pads that may be releasably secured by a member to a plurality of electrically conductive pads of the electronics module subsystem. The electronics module subsystem may have a substrate which supports both an electronics circuit and the interconnect pads.
- Inventors:
- Issue Date:
- Research Org.:
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1459550
- Patent Number(s):
- 9,999,363
- Application Number:
- 14/684,673
- Assignee:
- Lawrence Livermore National Security, LLC (Livermore, CA) LLNL
- DOE Contract Number:
- AC52-07NA27344
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2015 Apr 13
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Shah, Kedar G., Felix, Sarah H., Pannu, Satinderpall S., Tolosa, Vanessa, and Tooker, Angela C. System and method for neural interface with modular active electronics. United States: N. p., 2018.
Web.
Shah, Kedar G., Felix, Sarah H., Pannu, Satinderpall S., Tolosa, Vanessa, & Tooker, Angela C. System and method for neural interface with modular active electronics. United States.
Shah, Kedar G., Felix, Sarah H., Pannu, Satinderpall S., Tolosa, Vanessa, and Tooker, Angela C. Tue .
"System and method for neural interface with modular active electronics". United States. https://www.osti.gov/servlets/purl/1459550.
@article{osti_1459550,
title = {System and method for neural interface with modular active electronics},
author = {Shah, Kedar G. and Felix, Sarah H. and Pannu, Satinderpall S. and Tolosa, Vanessa and Tooker, Angela C.},
abstractNote = {A modular, high density electrical system is disclosed which makes use of an interface component, which is well suited to being placed in contact with an anatomy of either a human or an animal, and which may be releasably coupled to an electronics module subsystem. The interface component has a plurality of electrically conductive interconnect pads that may be releasably secured by a member to a plurality of electrically conductive pads of the electronics module subsystem. The electronics module subsystem may have a substrate which supports both an electronics circuit and the interconnect pads.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {6}
}
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