High voltage MOSFET devices and methods of making the devices
Abstract
A SiC MOSFET device having low specific on resistance is described. The device has N+, P-well and JFET regions extended in one direction (Y-direction) and P+ and source contacts extended in an orthogonal direction (X-direction). The polysilicon gate of the device covers the JFET region and is terminated over the P-well region to minimize electric field at the polysilicon gate edge. In use, current flows vertically from the drain contact at the bottom of the structure into the JFET region and then laterally in the X direction through the accumulation region and through the MOSFET channels into the adjacent N+ region. The current flowing out of the channel then flows along the N+ region in the Y-direction and is collected by the source contacts and the final metal. Methods of making the device are also described.
- Inventors:
- Issue Date:
- Research Org.:
- US Department of Energy (USDOE), Washington, DC (United States). Advanced Research Projects Agency-Energy (ARPA-E)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1455223
- Patent Number(s):
- 9991376
- Application Number:
- 14/966,476
- Assignee:
- Monolith Semiconductor Inc. (Round Rock, TX)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AR0000442
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2015 Dec 11
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Banerjee, Sujit, Matocha, Kevin, and Chatty, Kiran. High voltage MOSFET devices and methods of making the devices. United States: N. p., 2018.
Web.
Banerjee, Sujit, Matocha, Kevin, & Chatty, Kiran. High voltage MOSFET devices and methods of making the devices. United States.
Banerjee, Sujit, Matocha, Kevin, and Chatty, Kiran. Tue .
"High voltage MOSFET devices and methods of making the devices". United States. https://www.osti.gov/servlets/purl/1455223.
@article{osti_1455223,
title = {High voltage MOSFET devices and methods of making the devices},
author = {Banerjee, Sujit and Matocha, Kevin and Chatty, Kiran},
abstractNote = {A SiC MOSFET device having low specific on resistance is described. The device has N+, P-well and JFET regions extended in one direction (Y-direction) and P+ and source contacts extended in an orthogonal direction (X-direction). The polysilicon gate of the device covers the JFET region and is terminated over the P-well region to minimize electric field at the polysilicon gate edge. In use, current flows vertically from the drain contact at the bottom of the structure into the JFET region and then laterally in the X direction through the accumulation region and through the MOSFET channels into the adjacent N+ region. The current flowing out of the channel then flows along the N+ region in the Y-direction and is collected by the source contacts and the final metal. Methods of making the device are also described.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {6}
}
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