High thermal conductivity materials for thermal management applications
Abstract
High thermal conductivity materials and methods of their use for thermal management applications are provided. In some embodiments, a device comprises a heat generating unit (304) and a thermally conductive unit (306, 308, 310) in thermal communication with the heat generating unit (304) for conducting heat generated by the heat generating unit (304) away from the heat generating unit (304), the thermally conductive unit (306, 308, 310) comprising a thermally conductive compound, alloy or composite thereof. The thermally conductive compound may include Boron Arsenide, Boron Antimonide, Germanium Carbide and Beryllium Selenide.
- Inventors:
- Issue Date:
- Research Org.:
- The United States of America, as represented by the Secretary of the Navy, Washington, DC (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1452907
- Patent Number(s):
- 9,986,663
- Application Number:
- 14/763,993
- Assignee:
- The United States of America, as represented by the Secretary of the Navy (Washington, DC) EFRC
- DOE Contract Number:
- FG02-09ER46577; SC0001299
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2014 Jan 29
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 42 ENGINEERING
Citation Formats
Broido, David A., Reinecke, Thomas L., and Lindsay, Lucas R. High thermal conductivity materials for thermal management applications. United States: N. p., 2018.
Web.
Broido, David A., Reinecke, Thomas L., & Lindsay, Lucas R. High thermal conductivity materials for thermal management applications. United States.
Broido, David A., Reinecke, Thomas L., and Lindsay, Lucas R. Tue .
"High thermal conductivity materials for thermal management applications". United States. https://www.osti.gov/servlets/purl/1452907.
@article{osti_1452907,
title = {High thermal conductivity materials for thermal management applications},
author = {Broido, David A. and Reinecke, Thomas L. and Lindsay, Lucas R.},
abstractNote = {High thermal conductivity materials and methods of their use for thermal management applications are provided. In some embodiments, a device comprises a heat generating unit (304) and a thermally conductive unit (306, 308, 310) in thermal communication with the heat generating unit (304) for conducting heat generated by the heat generating unit (304) away from the heat generating unit (304), the thermally conductive unit (306, 308, 310) comprising a thermally conductive compound, alloy or composite thereof. The thermally conductive compound may include Boron Arsenide, Boron Antimonide, Germanium Carbide and Beryllium Selenide.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {5}
}
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