High thermal conductivity materials for thermal management applications
Abstract
High thermal conductivity materials and methods of their use for thermal management applications are provided. In some embodiments, a device comprises a heat generating unit (304) and a thermally conductive unit (306, 308, 310) in thermal communication with the heat generating unit (304) for conducting heat generated by the heat generating unit (304) away from the heat generating unit (304), the thermally conductive unit (306, 308, 310) comprising a thermally conductive compound, alloy or composite thereof. The thermally conductive compound may include Boron Arsenide, Boron Antimonide, Germanium Carbide and Beryllium Selenide.
- Inventors:
- Issue Date:
- Research Org.:
- The United States of America, as represented by the Secretary of the Navy, Washington, DC (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1452907
- Patent Number(s):
- 9986663
- Application Number:
- 14/763,993
- Assignee:
- The United States of America, as represented by the Secretary of the Navy (Washington, DC)
- Patent Classifications (CPCs):
-
F - MECHANICAL ENGINEERING F16 - ENGINEERING ELEMENTS AND UNITS F16D - COUPLINGS FOR TRANSMITTING ROTATION
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- DOE Contract Number:
- FG02-09ER46577; SC0001299
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2014 Jan 29
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 42 ENGINEERING
Citation Formats
Broido, David A., Reinecke, Thomas L., and Lindsay, Lucas R. High thermal conductivity materials for thermal management applications. United States: N. p., 2018.
Web.
Broido, David A., Reinecke, Thomas L., & Lindsay, Lucas R. High thermal conductivity materials for thermal management applications. United States.
Broido, David A., Reinecke, Thomas L., and Lindsay, Lucas R. Tue .
"High thermal conductivity materials for thermal management applications". United States. https://www.osti.gov/servlets/purl/1452907.
@article{osti_1452907,
title = {High thermal conductivity materials for thermal management applications},
author = {Broido, David A. and Reinecke, Thomas L. and Lindsay, Lucas R.},
abstractNote = {High thermal conductivity materials and methods of their use for thermal management applications are provided. In some embodiments, a device comprises a heat generating unit (304) and a thermally conductive unit (306, 308, 310) in thermal communication with the heat generating unit (304) for conducting heat generated by the heat generating unit (304) away from the heat generating unit (304), the thermally conductive unit (306, 308, 310) comprising a thermally conductive compound, alloy or composite thereof. The thermally conductive compound may include Boron Arsenide, Boron Antimonide, Germanium Carbide and Beryllium Selenide.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {5}
}
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Works referenced in this record:
Process for Preparing Crystalline Boron Arsenide
patent, November 1968
- Williams, Forest V.
- US Patent Document 3,413,092
First-Principles Determination of Ultrahigh Thermal Conductivity of Boron Arsenide: A Competitor for Diamond?
journal, July 2013
- Lindsay, L.; Broido, D. A.; Reinecke, T. L.
- Physical Review Letters, Vol. 111, Issue 2, Article No. 025901
High Lattice Thermal Conductivity Solids
book, January 2006
- Morelli, Donald T.; Slack, Glen A.; Shindé, Subhash L.
- High Thermal Conductivity Materials, p. 37-68
Germanium-silicon-carbide floating gates in memories
patent-application, August 2007
- Forbes, Leonard; Ahn, Kie Y.
- US Patent Document 11/731255; 20070195608
Semiconductor Device and Method of Manufacturing the Same
patent-application, March 2011
- Katagiri, Fumimasa; Chino, Teruaki; Tateiwa, Akihiko
- US Patent Document 12/856934; 20110062578
Reflection plate for backlight unit and backlight unit of liquid crystal display having good thermal conductivity
patent-application, March 2007
- Lee, Heon Sang; Kim, Eung Soo; Lee, Myung Se
- US Patent Document 11/511628; 20070047253
Thermal conductivity of GaN crystals grown by high pressure method
journal, November 2003
- Jeżowski, A.; Stachowiak, P.; Plackowski, T.
- physica status solidi (b), Vol. 240, Issue 2, p. 447-450
Process for depositing a III-V compound layer on a substrate
patent, May 1989
- Agostinelli, John A.; Gysling, Henry J.
- US Patent Document 4,833,103
Device and method using isotopically enriched silicon
patent-application, December 2005
- Gammel, Peter L.; Jones, Bailey R.; Kizilyalli, Isik
- US Patent Document 10/875029; 20050287786
Nonmetallic crystals with high thermal conductivity
journal, January 1973
- Slack, G. A.
- Journal of Physics and Chemistry of Solids, Vol. 34, Issue 2
Strained silicon MOSFETs having improved thermal dissipation
patent, May 2005
- Pan, James N.; Goo, Jung-Suk; Xiang, Qi
- US Patent Document 6,900,143
Thermal conductivity of isotopically enriched 28Si: revisited
journal, August 2004
- Kremer, R. K.; Graf, K.; Cardona, M.
- Solid State Communications, Vol. 131, Issue 8, p. 499-503
Slab laser and amplifier and method of use
patent, March 2016
- Stuart, Martin A.; Cunningham, Stephen L.
- US Patent Document 9,287,112