High thermal conductivity materials for thermal management applications

Title: High thermal conductivity materials for thermal management applications

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High thermal conductivity materials and methods of their use for thermal management applications are provided. In some embodiments, a device comprises a heat generating unit (304) and a thermally conductive unit (306, 308, 310) in thermal communication with the heat generating unit (304) for conducting heat generated by the heat generating unit (304) away from the heat generating unit (304), the thermally conductive unit (306, 308, 310) comprising a thermally conductive compound, alloy or composite thereof. The thermally conductive compound may include Boron Arsenide, Boron Antimonide, Germanium Carbide and Beryllium Selenide.

Inventors:: Broido, David A.; Reinecke, Thomas L.; Lindsay, Lucas R.

Issue Date:: 2018-05-29

OSTI Identifier:: 1452907

Assignee:: The United States of America, as represented by the Secretary of the Navy (Washington, DC) EFRC

Patent Number(s):: 9,986,663

Application Number:: 14/763,993

Contract Number:: FG02-09ER46577; SC0001299

Resource Relation:: Patent File Date: 2014 Jan 29

Research Org:: The United States of America, as represented by the Secretary of the Navy, Washington, DC (United States)

Sponsoring Org:: USDOE

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE; 42 ENGINEERING

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