Title: Lateral vias for connections to buried microconductors

Abstract

The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.

Inventors:

Adams, David P.; Fishgrab, Kira L.; Greth, Karl Douglas; Henry, Michael David; Stevens, Jeffrey; Hodges, V. Carter; Shul, Randy J.; Goeke, Ronald S.; Grubbs, Robert K.

Issue Date:

2018-05-15

Research Org.:

Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1440750

Patent Number(s):

9972565

Application Number:

15/175,312

Assignee:

National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)

Patent Classifications (CPCs):

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

Show more

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L24/16 - {of an individual bump connector}
H01L23/147 - {Semiconductor insulating substrates
H01L21/4853 - {Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps}
H01L2225/06572 - Auxiliary carrier between devices, the carrier having an electrical connection structure
H01L23/49822 - {Multilayer substrates
H01L2225/06517 - Bump or bump-like direct electrical connections from device to substrate
H01L23/5386 - {Geometry or layout of the interconnection structure}
H01L24/13 - {of an individual bump connector}
H01L23/5384 - {Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
H01L25/0652 - {the devices being arranged next and on each other, i.e. mixed assemblies}
H01L2924/014 - Solder alloys
H01L2224/25105 - Connecting at different heights
H01L23/3121 - {a substrate forming part of the encapsulation}
H01L25/065 - the devices being of a type provided for in group H01L27/00
H01L2924/15311 - being a ball array, e.g. BGA
H01L2224/16225 - the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L21/743 - {Making of internal connections, substrate contacts}
H01L2224/13009 - Bump connector integrally formed with a via connection of the semiconductor or solid-state body
H01L21/76898 - {formed through a semiconductor substrate}
H01L23/535 - including internal interconnections, e.g. cross-under constructions {
H01L23/481 - {Internal lead connections, e.g. via connections, feedthrough structures}
H01L21/486 - {Via connections through the substrate with or without pins}
H01L23/49827 - {Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
H01L2224/13101 - the principal constituent melting at a temperature of less than 400°C
H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
H01L2224/16145 - the bodies being stacked
H01L24/25 - {of a plurality of high density interconnect connectors}
H01L21/4803 - {Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks

Show less

DOE Contract Number:  

AC04-94AL85000

Resource Type:

Patent

Resource Relation:

Patent File Date: 2016 Jun 07

Country of Publication:

United States

Language:

English

Subject:

42 ENGINEERING