Lateral vias for connections to buried microconductors
Abstract
The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1440750
- Patent Number(s):
- 9972565
- Application Number:
- 15/175,312
- Assignee:
- National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2016 Jun 07
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Adams, David P., Fishgrab, Kira L., Greth, Karl Douglas, Henry, Michael David, Stevens, Jeffrey, Hodges, V. Carter, Shul, Randy J., Goeke, Ronald S., and Grubbs, Robert K. Lateral vias for connections to buried microconductors. United States: N. p., 2018.
Web.
Adams, David P., Fishgrab, Kira L., Greth, Karl Douglas, Henry, Michael David, Stevens, Jeffrey, Hodges, V. Carter, Shul, Randy J., Goeke, Ronald S., & Grubbs, Robert K. Lateral vias for connections to buried microconductors. United States.
Adams, David P., Fishgrab, Kira L., Greth, Karl Douglas, Henry, Michael David, Stevens, Jeffrey, Hodges, V. Carter, Shul, Randy J., Goeke, Ronald S., and Grubbs, Robert K. Tue .
"Lateral vias for connections to buried microconductors". United States. https://www.osti.gov/servlets/purl/1440750.
@article{osti_1440750,
title = {Lateral vias for connections to buried microconductors},
author = {Adams, David P. and Fishgrab, Kira L. and Greth, Karl Douglas and Henry, Michael David and Stevens, Jeffrey and Hodges, V. Carter and Shul, Randy J. and Goeke, Ronald S. and Grubbs, Robert K.},
abstractNote = {The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {5}
}
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