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Title: Lateral vias for connections to buried microconductors

Abstract

The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.

Inventors:
; ; ; ; ; ; ; ;
Issue Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1440750
Patent Number(s):
9972565
Application Number:
15/175,312
Assignee:
National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 2016 Jun 07
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Adams, David P., Fishgrab, Kira L., Greth, Karl Douglas, Henry, Michael David, Stevens, Jeffrey, Hodges, V. Carter, Shul, Randy J., Goeke, Ronald S., and Grubbs, Robert K. Lateral vias for connections to buried microconductors. United States: N. p., 2018. Web.
Adams, David P., Fishgrab, Kira L., Greth, Karl Douglas, Henry, Michael David, Stevens, Jeffrey, Hodges, V. Carter, Shul, Randy J., Goeke, Ronald S., & Grubbs, Robert K. Lateral vias for connections to buried microconductors. United States.
Adams, David P., Fishgrab, Kira L., Greth, Karl Douglas, Henry, Michael David, Stevens, Jeffrey, Hodges, V. Carter, Shul, Randy J., Goeke, Ronald S., and Grubbs, Robert K. Tue . "Lateral vias for connections to buried microconductors". United States. https://www.osti.gov/servlets/purl/1440750.
@article{osti_1440750,
title = {Lateral vias for connections to buried microconductors},
author = {Adams, David P. and Fishgrab, Kira L. and Greth, Karl Douglas and Henry, Michael David and Stevens, Jeffrey and Hodges, V. Carter and Shul, Randy J. and Goeke, Ronald S. and Grubbs, Robert K.},
abstractNote = {The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {5}
}

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