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Title: Lateral vias for connections to buried microconductors

The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.
Inventors:
; ; ; ; ; ; ; ;
Issue Date:
OSTI Identifier:
1440750
Assignee:
National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM) SNL-A
Patent Number(s):
9,972,565
Application Number:
15/175,312
Contract Number:
AC04-94AL85000
Resource Relation:
Patent File Date: 2016 Jun 07
Research Org:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

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  • Elam, J. W.; Routkevitch, D.; Mardilovich, P. P.
  • Chemistry of Materials, Vol. 15, Issue 18, p. 3507-3517
  • DOI: 10.1021/cm0303080

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journal, March 2003
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journal, May 2011
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