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Title: Lateral vias for connections to buried microconductors

The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.
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Issue Date:
OSTI Identifier:
National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM) SNL-A
Patent Number(s):
Application Number:
Contract Number:
Resource Relation:
Patent File Date: 2016 Jun 07
Research Org:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org:
Country of Publication:
United States

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Conformal Coating on Ultrahigh-Aspect-Ratio Nanopores of Anodic Alumina by Atomic Layer Deposition
journal, September 2003
  • Elam, J. W.; Routkevitch, D.; Mardilovich, P. P.
  • Chemistry of Materials, Vol. 15, Issue 18, p. 3507-3517
  • DOI: 10.1021/cm0303080

A Kinetic Model for Step Coverage by Atomic Layer Deposition in Narrow Holes or Trenches
journal, March 2003
  • Gordon, R. G.; Hausmann, D.; Kim, E.
  • Chemical Vapor Deposition, Vol. 9, Issue 2, p. 73-78
  • DOI: 10.1002/cvde.200390005

Surface Loss in Ozone-Based Atomic Layer Deposition Processes
journal, May 2011
  • Knoops, Harm C.M.; Elam, Jeffrey W.; Libera, Joseph A.
  • Chemistry of Materials, Vol. 23, Issue 9, p. 2381-2387
  • DOI: 10.1021/cm2001144

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