Lateral vias for connections to buried microconductors

Title: Lateral vias for connections to buried microconductors

The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.

Inventors:: Adams, David P.; Fishgrab, Kira L.; Greth, Karl Douglas; Henry, Michael David; Stevens, Jeffrey; Hodges, V. Carter; Shul, Randy J.; Goeke, Ronald S.; Grubbs, Robert K.

Issue Date:: 2018-05-15

OSTI Identifier:: 1440750

Assignee:: National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM) SNL-A

Patent Number(s):: 9,972,565

Application Number:: 15/175,312

Contract Number:: AC04-94AL85000

Resource Relation:: Patent File Date: 2016 Jun 07

Research Org:: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Sponsoring Org:: USDOE

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING

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Other works cited in this record:

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patent, June 2003

Adams, David; Vasile, Michael
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Adams, David; McDonald, Joel; Jared, Bradley
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