Spreading devices into a 2-D module layout
Abstract
An apparatus, method, and system, the apparatus including a receiving member dimensioned to receive an array of microelectronic devices; and a linkage member coupled to the receiving member, the linkage member configured to move the receiving member in at least two dimensions so as to modify a spacing between the electronic devices within the array of microelectronic devices received by the receiving member. The method including coupling an array of microelectronic devices to an expansion assembly; and expanding the expansion assembly so as to expand the array of microelectronic devices in at least two directions within a single plane. The system including a support member; an expansion assembly coupled to the support member, the expansion assembly having a plurality of receiving members configured to move in at least two dimensions within a single plane; and a plurality of microelectronic devices coupled to each of the plurality of receiving members.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1440749
- Patent Number(s):
- 9972736
- Application Number:
- 14/205,839
- Assignee:
- National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2014 Mar 12
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 42 ENGINEERING
Citation Formats
Koplow, Jeffrey P., Gupta, Vipin P., Nielson, Gregory N., Okandan, Murat, Cruz-Campa, Jose Luis, and Nelson, Jeffrey S. Spreading devices into a 2-D module layout. United States: N. p., 2018.
Web.
Koplow, Jeffrey P., Gupta, Vipin P., Nielson, Gregory N., Okandan, Murat, Cruz-Campa, Jose Luis, & Nelson, Jeffrey S. Spreading devices into a 2-D module layout. United States.
Koplow, Jeffrey P., Gupta, Vipin P., Nielson, Gregory N., Okandan, Murat, Cruz-Campa, Jose Luis, and Nelson, Jeffrey S. Tue .
"Spreading devices into a 2-D module layout". United States. https://www.osti.gov/servlets/purl/1440749.
@article{osti_1440749,
title = {Spreading devices into a 2-D module layout},
author = {Koplow, Jeffrey P. and Gupta, Vipin P. and Nielson, Gregory N. and Okandan, Murat and Cruz-Campa, Jose Luis and Nelson, Jeffrey S.},
abstractNote = {An apparatus, method, and system, the apparatus including a receiving member dimensioned to receive an array of microelectronic devices; and a linkage member coupled to the receiving member, the linkage member configured to move the receiving member in at least two dimensions so as to modify a spacing between the electronic devices within the array of microelectronic devices received by the receiving member. The method including coupling an array of microelectronic devices to an expansion assembly; and expanding the expansion assembly so as to expand the array of microelectronic devices in at least two directions within a single plane. The system including a support member; an expansion assembly coupled to the support member, the expansion assembly having a plurality of receiving members configured to move in at least two dimensions within a single plane; and a plurality of microelectronic devices coupled to each of the plurality of receiving members.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {5}
}
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