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Title: Provisioning cooling elements for chillerless data centers

Abstract

Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.

Inventors:
;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1440740
Patent Number(s):
9974213
Application Number:
14/715,944
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Classifications (CPCs):
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
G - PHYSICS G06 - COMPUTING G06F - ELECTRIC DIGITAL DATA PROCESSING
DOE Contract Number:  
EE0002894
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 May 19
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Chainer, Timothy J., and Parida, Pritish R. Provisioning cooling elements for chillerless data centers. United States: N. p., 2018. Web.
Chainer, Timothy J., & Parida, Pritish R. Provisioning cooling elements for chillerless data centers. United States.
Chainer, Timothy J., and Parida, Pritish R. Tue . "Provisioning cooling elements for chillerless data centers". United States. https://www.osti.gov/servlets/purl/1440740.
@article{osti_1440740,
title = {Provisioning cooling elements for chillerless data centers},
author = {Chainer, Timothy J. and Parida, Pritish R.},
abstractNote = {Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {5}
}

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Works referenced in this record:

TAPO: Thermal-aware power optimization techniques for servers and data centers
conference, September 2011


Optimal heat transfer for liquid cooling with minimal coolant volume
conference, May 2011


Managing server energy and operational costs in hosting centers
conference, June 2005

  • Chen, Yiyu; Das, Amitayu; Qin, Wubi
  • SIGMETRICS '05 Proceedings of the 2005 ACM SIGMETRICS international conference on Measurement and modeling of computer systems, Vol. 33, Issue 1, p. 303-314
  • https://doi.org/10.1145/1064212.1064253

Temperature-aware dynamic resource provisioning in a power-optimized datacenter
conference, March 2010