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Title: Waveguide module comprising a first plate with a waveguide channel and a second plate with a raised portion in which a sealing layer is forced into the waveguide channel by the raised portion

Abstract

The various technologies presented herein relate to utilizing a sealing layer of malleable material to seal gaps, etc., at a joint between edges of a waveguide channel formed in a first plate and a surface of a clamping plate. A compression pad is included in the surface of the clamping plate and is dimensioned such that the upper surface of the pad is less than the area of the waveguide channel opening on the first plate. The sealing layer is placed between the waveguide plate and the clamping plate, and during assembly of the waveguide module, the compression pad deforms a portion of the sealing layer such that it ingresses into the waveguide channel opening. Deformation of the sealing layer results in the gaps, etc., to be filled, improving the operational integrity of the joint.

Inventors:
; ; ;
Issue Date:
Research Org.:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1435614
Patent Number(s):
9947981
Application Number:
15/159,377
Assignee:
National Technology & Engineering Solutions of Sandian, LLC (Albuquerque, NM)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01P - WAVEGUIDES
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 2016 May 19
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Strassner, II, Bernd H., Liedtke, Richard, McDonald, Jacob Jeremiah, and Halligan, Matthew. Waveguide module comprising a first plate with a waveguide channel and a second plate with a raised portion in which a sealing layer is forced into the waveguide channel by the raised portion. United States: N. p., 2018. Web.
Strassner, II, Bernd H., Liedtke, Richard, McDonald, Jacob Jeremiah, & Halligan, Matthew. Waveguide module comprising a first plate with a waveguide channel and a second plate with a raised portion in which a sealing layer is forced into the waveguide channel by the raised portion. United States.
Strassner, II, Bernd H., Liedtke, Richard, McDonald, Jacob Jeremiah, and Halligan, Matthew. Tue . "Waveguide module comprising a first plate with a waveguide channel and a second plate with a raised portion in which a sealing layer is forced into the waveguide channel by the raised portion". United States. https://www.osti.gov/servlets/purl/1435614.
@article{osti_1435614,
title = {Waveguide module comprising a first plate with a waveguide channel and a second plate with a raised portion in which a sealing layer is forced into the waveguide channel by the raised portion},
author = {Strassner, II, Bernd H. and Liedtke, Richard and McDonald, Jacob Jeremiah and Halligan, Matthew},
abstractNote = {The various technologies presented herein relate to utilizing a sealing layer of malleable material to seal gaps, etc., at a joint between edges of a waveguide channel formed in a first plate and a surface of a clamping plate. A compression pad is included in the surface of the clamping plate and is dimensioned such that the upper surface of the pad is less than the area of the waveguide channel opening on the first plate. The sealing layer is placed between the waveguide plate and the clamping plate, and during assembly of the waveguide module, the compression pad deforms a portion of the sealing layer such that it ingresses into the waveguide channel opening. Deformation of the sealing layer results in the gaps, etc., to be filled, improving the operational integrity of the joint.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {4}
}

Works referenced in this record:

Machined waveguide
patent, September 1986


Integrated waveguide combiner
patent, July 1993


Waveguide in a printed circuit board and method of forming the same
patent, April 2005


Guiding Devices for Electromagnetic Waves and Process for Manufacturing These Guiding Devices
patent-application, November 2007