Pin fin compliant heat sink with enhanced flexibility
Abstract
Heat sinks and methods of using the same include a top and bottom plate, at least one of which has a plurality of pin contacts flexibly connected to one another, where the plurality of pin contacts have vertical and lateral flexibility with respect to one another; and pin slice layers, each having multiple pin slices, arranged vertically between the top and bottom plates such that the plurality of pin slices form substantially vertical pins connecting the top and bottom plates.
- Inventors:
- Issue Date:
- Research Org.:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1434516
- Patent Number(s):
- 9939210
- Application Number:
- 14/500,541
- Assignee:
- International Business Machines Corporation, Armonk, NY
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23P - OTHER WORKING OF METAL
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- DOE Contract Number:
- EE0002894
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2014 Sep 29
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Schultz, Mark D. Pin fin compliant heat sink with enhanced flexibility. United States: N. p., 2018.
Web.
Schultz, Mark D. Pin fin compliant heat sink with enhanced flexibility. United States.
Schultz, Mark D. Tue .
"Pin fin compliant heat sink with enhanced flexibility". United States. https://www.osti.gov/servlets/purl/1434516.
@article{osti_1434516,
title = {Pin fin compliant heat sink with enhanced flexibility},
author = {Schultz, Mark D.},
abstractNote = {Heat sinks and methods of using the same include a top and bottom plate, at least one of which has a plurality of pin contacts flexibly connected to one another, where the plurality of pin contacts have vertical and lateral flexibility with respect to one another; and pin slice layers, each having multiple pin slices, arranged vertically between the top and bottom plates such that the plurality of pin slices form substantially vertical pins connecting the top and bottom plates.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Apr 10 00:00:00 EDT 2018},
month = {Tue Apr 10 00:00:00 EDT 2018}
}
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Works referenced in this record:
Restorable backbond for LSI chips using liquid metal coated dendrites
patent, March 1981
- Babuka, Robert; Heath, Robert E.; Saxenmeyer, Jr., George J.
- US Patent Document 4,254,431
Apparatus for cooling high-density integrated circuit packages
patent, April 1983
- Cutchaw, John M.
- US Patent Document 4,381,032
Cooling element for solder bonded semiconductor devices
patent, April 1984
- Lipschutz, Lewis D.; Meagher, Ralph E.; Presti, Frank P.
- US Patent Document 4,442,450
Flexible finned heat exchanger
patent, June 1991
- Flint, Ephraim B.; Grebe, Kurt R.; Gruber, Peter A.
- US Patent Document 5,022,462
Compliant thermal connectors, methods of making the same and assemblies incorporating the same
patent, July 1997
- DiStefano, Thomas H.; Smith, John W.
- US Patent Document 5,650,914
Flexibly suspended heat exchange head for a DUT
patent, May 2002
- Jones, Elmer R.
- US Patent Document 6,392,431
Pin retention for thermal transfer interfaces, and associated methods
patent, March 2005
- Belady, Christian L.; Peterson, Eric C.
- US Patent Document 6,867,976
Flexible heat exchangers for medical cooling and warming applications
patent, July 2006
- Fletcher, R. David; Chen, Yunquan
- US Patent Document 7,077,858
Compliant thermal interface structure with vapor chamber
patent, September 2007
- Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C.
- US Patent Document 7,264,041
Compliant thermal interface structure utilizing spring elements
patent, April 2008
- Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C.
- US Patent Document 7,355,855
Cooling structure using rigid movable elements
patent, April 2008
- Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C.
- US Patent Document 7,362,582
Flexible heat sink
patent, July 2008
- McCutcheon, Jeffrey W.; Narum, Timothy N.; Soo, Philip P.
- US Patent Document 7,399,919
Compliant thermal interface structure utilizing spring elements with fins
patent, August 2008
- Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C.
- US Patent Document 7,408,780
Integrated cooling system
patent, January 2009
- Nelson, Richard D.; Somadder, Anjan
- US Patent Document RE40,618
Compliant thermal interface structure utilizing spring elements
patent, June 2009
- Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C.
- US Patent Document 7,545,647
Cooling structure using rigid movable elements
patent, June 2009
- Karidis, John P.; Schultz, Mark D.; Webb, Bucknell C.
- US Patent Document 7,545,648
Integrated circuit package system with a heat sink
patent, October 2011
- Lee, Sangkwon; Lee, Tae Keun
- US Patent Document 8,030,755
Flexible heat sink with lateral compliance
patent, May 2014
- Schultz, Mark D.
- US Patent Document 8,736,048
Flexible heat exchangers
patent-application, March 2005
- Fletcher, R. David; Chen, Yunquan
- US Patent Application 10/665074; 20050061473
Apparatus and Methods for Warming and Cooling Bodies
patent-application, August 2006
- Fletcher, R. David; Fletcher, John Robert; Au, Katie Man-Ki
- US Patent Application 11/277078; 20060191675
Compliant Pin Fin Heat Sink and Methods
patent-application, August 2013
- Karidis, John P.; Schultz, Mark D.
- US Patent Application 13/364907; 20130199767