Title: Systems and methods of manufacturing microchannel arrays

Abstract

The present application relates to apparatus and methods of reducing the cost of microchannel array production and operation. In a representative embodiment, a microchannel array can comprise a first lamina having one or more flanges and a plurality of elongated bosses. The one or more flanges can extend along a perimeter of the first lamina, the plurality of elongated bosses can at least partially define a plurality of first flow paths, and the first lamina can define at least one opening. The microchannel array can also comprise a second lamina having a plurality of second flow paths, and can define at least one opening. The second lamina can be disposed above the first lamina such that the second lamina encloses the first flow paths of the first lamina and the at least one opening of the first lamina is coaxial with the at least one opening of the second lamina.

Inventors:

Paul, Brian K.; Brannon, Samuel T.

Issue Date:

2018-03-20

Research Org.:

Pacific Northwest National Laboratory (PNNL), Richland, WA (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1429407

Patent Number(s):

9921006

Application Number:

14/774,093

Assignee:

Oregon State University (Corvallis, OR)

Patent Classifications (CPCs):

B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23P - OTHER WORKING OF METAL

B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM

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B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23P - OTHER WORKING OF METAL

B23P15/26 - heat exchangers {or the like

B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM

B32B2311/00 - Metals, their alloys or their compounds
B32B2457/00 - Electrical equipment
B32B37/12 - characterised by using adhesives
B32B37/18 - involving the assembly of discrete sheets or panels only

B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81B - MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES

B81B2201/058 - Microfluidics not provided for in B81B2201/051 - B81B2201/054

B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS

B81C2201/019 - Bonding or gluing multiple substrate layers
B81C99/0095 - {Aspects relating to the manufacture of substrate-free structures, not covered by groups B81C99/008 - B81C99/009}

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT

F28D9/0043 - {the plates having openings therein for circulation of at least one heat-exchange medium from one conduit to another}

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION

F28F2260/02 - having microchannels
F28F3/025 - {the means being corrugated, plate-like elements}
F28F3/046 - {the deformations being linear, e.g. corrugations}
F28F9/02 - Header boxes

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DOE Contract Number:  

AC06-76RL01830

Resource Type:

Patent

Resource Relation:

Patent File Date: 2014 Mar 12

Country of Publication:

United States

Language:

English

Subject:

42 ENGINEERING