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Title: Selective, electrochemical etching of a semiconductor

Abstract

Methods for facilitating fabricating semiconductor structures are provided which include: providing a multilayer structure including a semiconductor layer, the semiconductor layer including a dopant and having an increased conductivity; selectively increasing, using electrochemical processing, porosity of the semiconductor layer, at least in part, the selectively increasing porosity utilizing the increased conductivity of the semiconductor layer; and removing, at least in part, the semiconductor layer with the selectively increased porosity from the multilayer structure. By way of example, the selectively increasing porosity may include selectively, anodically oxidizing, at least in part, the semiconductor layer of the multilayer structure.

Inventors:
; ;
Issue Date:
Research Org.:
Rensselaer Polytechnic Inst., Troy, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1429084
Patent Number(s):
9922838
Application Number:
15/116,041
Assignee:
Rensselaer Polytechnic Institute, Troy, NY
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
AR0000304
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 Feb 10
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Dahal, Rajendra P., Bhat, Ishwara B., and Chow, Tat-Sing. Selective, electrochemical etching of a semiconductor. United States: N. p., 2018. Web.
Dahal, Rajendra P., Bhat, Ishwara B., & Chow, Tat-Sing. Selective, electrochemical etching of a semiconductor. United States.
Dahal, Rajendra P., Bhat, Ishwara B., and Chow, Tat-Sing. Tue . "Selective, electrochemical etching of a semiconductor". United States. https://www.osti.gov/servlets/purl/1429084.
@article{osti_1429084,
title = {Selective, electrochemical etching of a semiconductor},
author = {Dahal, Rajendra P. and Bhat, Ishwara B. and Chow, Tat-Sing},
abstractNote = {Methods for facilitating fabricating semiconductor structures are provided which include: providing a multilayer structure including a semiconductor layer, the semiconductor layer including a dopant and having an increased conductivity; selectively increasing, using electrochemical processing, porosity of the semiconductor layer, at least in part, the selectively increasing porosity utilizing the increased conductivity of the semiconductor layer; and removing, at least in part, the semiconductor layer with the selectively increased porosity from the multilayer structure. By way of example, the selectively increasing porosity may include selectively, anodically oxidizing, at least in part, the semiconductor layer of the multilayer structure.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Mar 20 00:00:00 EDT 2018},
month = {Tue Mar 20 00:00:00 EDT 2018}
}

Works referenced in this record:

Method of fabricating porous silicon carbide (SiC)
patent, October 1995


Photoelectrochemical Undercut Etching of Semiconductor Material
patent-application, March 2003


Method for Producing Gallium Nitride Substrates for Electronic and Optoelectronic Devices
patent-application, August 2013