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Title: Multilayer capacitors, method for making multilayer capacitors

Abstract

The invention provides a stacked capacitor configuration comprising subunits each with a thickness of as low as 20 microns. Also provided is combination capacitor and printed wire board wherein the capacitor is encapsulated by the wire board. The invented capacitors are applicable in micro-electronic applications and high power applications, whether it is AC to DC or DC to AC, or DC to DC.

Inventors:
;
Issue Date:
Research Org.:
Argonne National Laboratory (ANL), Argonne, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1425940
Patent Number(s):
9908817
Application Number:
13/528,544
Assignee:
UChicago Argonne, LLC (Chicago, IL)
Patent Classifications (CPCs):
C - CHEMISTRY C04 - CEMENTS C04B - LIME, MAGNESIA
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
DOE Contract Number:  
AC02-06CH11357
Resource Type:
Patent
Resource Relation:
Patent File Date: 2012 Jun 20
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Ma, Beihai, and Balachandran, Uthamalingam. Multilayer capacitors, method for making multilayer capacitors. United States: N. p., 2018. Web.
Ma, Beihai, & Balachandran, Uthamalingam. Multilayer capacitors, method for making multilayer capacitors. United States.
Ma, Beihai, and Balachandran, Uthamalingam. Tue . "Multilayer capacitors, method for making multilayer capacitors". United States. https://www.osti.gov/servlets/purl/1425940.
@article{osti_1425940,
title = {Multilayer capacitors, method for making multilayer capacitors},
author = {Ma, Beihai and Balachandran, Uthamalingam},
abstractNote = {The invention provides a stacked capacitor configuration comprising subunits each with a thickness of as low as 20 microns. Also provided is combination capacitor and printed wire board wherein the capacitor is encapsulated by the wire board. The invented capacitors are applicable in micro-electronic applications and high power applications, whether it is AC to DC or DC to AC, or DC to DC.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Mar 06 00:00:00 EST 2018},
month = {Tue Mar 06 00:00:00 EST 2018}
}

Works referenced in this record:

Method of Fabricating Multilayer Ceramic Capacitors
patent, August 1972


High dielectric multilayer capacitor
patent, August 1989


Packaged electrical component
patent, March 1995


High capacitance thin film capacitor
patent, October 1995


High power capacitor
patent, April 1997


Multi-layer film capacitor structures and method
patent, April 1998


Nonlinear optical materials and process for producing the same
patent, September 1998


Capacitor module, bank of such modules, and storehouse housing such banks
patent, April 2001


Capacitor stack structure and method of fabricating description
patent, January 2002


Dielectric ceramic and monolithic ceramic capacitor including same
patent, December 2004


Thin film dielectrics for capacitors and methods of making thereof
patent, April 2006


Multi-level thin film capacitor on a ceramic substrate
patent, May 2007


Method for fabricating dielectric capacitor
patent-application, September 2001


Silicon carbide semiconductor device and its manufacturing method
patent-application, June 2003


Process for the producing of electrolytic capacitors
patent-application, November 2005


Method and apparatus for a capacitor shell including two mateable cupped components
patent-application, January 2006


Method for Fabrication of Ceramic Dielectric Films on Copper Foils
patent-application, December 2010


Improved dielectric properties of lead zirconate titanate thin films deposited on metal foils with LaNiO3 buffer layers
journal, February 2001


Evolution of materials technology for stacked-capacitors in 65nm embedded-DRAM
journal, November 2005


Chemical solution deposition of ferroelectric lead lanthanum zirconate titanate films on base-metal foils
journal, January 2008