Multilayer capacitors, method for making multilayer capacitors
Abstract
The invention provides a stacked capacitor configuration comprising subunits each with a thickness of as low as 20 microns. Also provided is combination capacitor and printed wire board wherein the capacitor is encapsulated by the wire board. The invented capacitors are applicable in micro-electronic applications and high power applications, whether it is AC to DC or DC to AC, or DC to DC.
- Inventors:
- Issue Date:
- Research Org.:
- Argonne National Laboratory (ANL), Argonne, IL (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1425940
- Patent Number(s):
- 9908817
- Application Number:
- 13/528,544
- Assignee:
- UChicago Argonne, LLC (Chicago, IL)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C04 - CEMENTS C04B - LIME, MAGNESIA
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
- DOE Contract Number:
- AC02-06CH11357
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2012 Jun 20
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Ma, Beihai, and Balachandran, Uthamalingam. Multilayer capacitors, method for making multilayer capacitors. United States: N. p., 2018.
Web.
Ma, Beihai, & Balachandran, Uthamalingam. Multilayer capacitors, method for making multilayer capacitors. United States.
Ma, Beihai, and Balachandran, Uthamalingam. Tue .
"Multilayer capacitors, method for making multilayer capacitors". United States. https://www.osti.gov/servlets/purl/1425940.
@article{osti_1425940,
title = {Multilayer capacitors, method for making multilayer capacitors},
author = {Ma, Beihai and Balachandran, Uthamalingam},
abstractNote = {The invention provides a stacked capacitor configuration comprising subunits each with a thickness of as low as 20 microns. Also provided is combination capacitor and printed wire board wherein the capacitor is encapsulated by the wire board. The invented capacitors are applicable in micro-electronic applications and high power applications, whether it is AC to DC or DC to AC, or DC to DC.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {3}
}
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