Hybrid chip-on-board LED module with patterned encapsulation
Abstract
Different wavelength conversion materials, or different concentrations of a wavelength conversion material are used to encapsulate the light emitting elements of different colors of a hybrid light emitting module. In an embodiment of this invention, second light emitting elements (170) of a particular color are encapsulated with a transparent second encapsulant (120;420;520), while first light emitting elements (160) of a different color are encapsulated with a wavelength conversion first encapsulant (110;410;510). In another embodiment of this invention, a particular second set of second and third light emitting elements (170,580) of different colors is encapsulated with a different encapsulant than another first set of first light emitting elements (160).
- Inventors:
- Issue Date:
- Research Org.:
- Lumileds LLC, San Jose, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1423437
- Patent Number(s):
- 9905737
- Application Number:
- PCT/IB2014/064070
- Assignee:
- Lumileds LLC (San Jose, CA)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05B - ELECTRIC HEATING
- DOE Contract Number:
- EE0005099
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2014 Aug 26
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Soer, Wouter Anthon, Helbing, Rene, and Huang, Guan. Hybrid chip-on-board LED module with patterned encapsulation. United States: N. p., 2018.
Web.
Soer, Wouter Anthon, Helbing, Rene, & Huang, Guan. Hybrid chip-on-board LED module with patterned encapsulation. United States.
Soer, Wouter Anthon, Helbing, Rene, and Huang, Guan. Tue .
"Hybrid chip-on-board LED module with patterned encapsulation". United States. https://www.osti.gov/servlets/purl/1423437.
@article{osti_1423437,
title = {Hybrid chip-on-board LED module with patterned encapsulation},
author = {Soer, Wouter Anthon and Helbing, Rene and Huang, Guan},
abstractNote = {Different wavelength conversion materials, or different concentrations of a wavelength conversion material are used to encapsulate the light emitting elements of different colors of a hybrid light emitting module. In an embodiment of this invention, second light emitting elements (170) of a particular color are encapsulated with a transparent second encapsulant (120;420;520), while first light emitting elements (160) of a different color are encapsulated with a wavelength conversion first encapsulant (110;410;510). In another embodiment of this invention, a particular second set of second and third light emitting elements (170,580) of different colors is encapsulated with a different encapsulant than another first set of first light emitting elements (160).},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {2}
}
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