Radio frequency plasma method for uniform surface processing of RF cavities and other three-dimensional structures
Abstract
A method for efficient plasma etching of surfaces inside three-dimensional structures can include positioning an inner electrode within the chamber cavity; evacuating the chamber cavity; adding a first inert gas to the chamber cavity; regulating the pressure in the chamber; generating a plasma sheath along the inner wall of the chamber cavity; adjusting a positive D.C. bias on the inner electrode to establish an effective plasma sheath voltage; adding a first electronegative gas to the chamber cavity; optionally readjusting the positive D.C. bias on the inner electrode reestablish the effective plasma sheath voltage at the chamber cavity; etching the inner wall of the chamber cavity; and polishing the inner wall to a desired surface roughness.
- Inventors:
- Issue Date:
- Research Org.:
- Old Dominion University Research Foundation, Norfolk, VA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1414940
- Patent Number(s):
- 9852891
- Application Number:
- 14/688,363
- Assignee:
- Old Dominion University Research Foundation (Norfolk, VA)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01J - ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2015 Apr 16
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 42 ENGINEERING
Citation Formats
Popovic, Svetozar, Upadhyay, Janardan, Vuskovic, Leposava, Phillips, H. Lawrence, and Valente-Feliciano, Anne-Marie. Radio frequency plasma method for uniform surface processing of RF cavities and other three-dimensional structures. United States: N. p., 2017.
Web.
Popovic, Svetozar, Upadhyay, Janardan, Vuskovic, Leposava, Phillips, H. Lawrence, & Valente-Feliciano, Anne-Marie. Radio frequency plasma method for uniform surface processing of RF cavities and other three-dimensional structures. United States.
Popovic, Svetozar, Upadhyay, Janardan, Vuskovic, Leposava, Phillips, H. Lawrence, and Valente-Feliciano, Anne-Marie. Tue .
"Radio frequency plasma method for uniform surface processing of RF cavities and other three-dimensional structures". United States. https://www.osti.gov/servlets/purl/1414940.
@article{osti_1414940,
title = {Radio frequency plasma method for uniform surface processing of RF cavities and other three-dimensional structures},
author = {Popovic, Svetozar and Upadhyay, Janardan and Vuskovic, Leposava and Phillips, H. Lawrence and Valente-Feliciano, Anne-Marie},
abstractNote = {A method for efficient plasma etching of surfaces inside three-dimensional structures can include positioning an inner electrode within the chamber cavity; evacuating the chamber cavity; adding a first inert gas to the chamber cavity; regulating the pressure in the chamber; generating a plasma sheath along the inner wall of the chamber cavity; adjusting a positive D.C. bias on the inner electrode to establish an effective plasma sheath voltage; adding a first electronegative gas to the chamber cavity; optionally readjusting the positive D.C. bias on the inner electrode reestablish the effective plasma sheath voltage at the chamber cavity; etching the inner wall of the chamber cavity; and polishing the inner wall to a desired surface roughness.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2017},
month = {12}
}
Works referenced in this record:
Process chamber cleaning method
patent-application, May 2007
- Sin, Il-Kwon
- US Patent Application 11/398720; 20070107749