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Title: Capacitor assembly and related method of forming

Abstract

A capacitor assembly is disclosed. The capacitor assembly includes a housing. The capacitor assembly further includes a plurality of capacitors disposed within the housing. Furthermore, the capacitor assembly includes a thermally conductive article disposed about at least a portion of a capacitor body of the capacitors, and in thermal contact with the capacitor body. Moreover, the capacitor assembly also includes a heat sink disposed within the housing and in thermal contact with at least a portion of the housing and the thermally conductive article such that the heat sink is configured to remove heat from the capacitor in a radial direction of the capacitor assembly. Further, a method of forming the capacitor assembly is also presented.

Inventors:
; ;
Issue Date:
Research Org.:
GE Global Research, Niskayuna, New York (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1414406
Patent Number(s):
9847174
Application Number:
14/964,120
Assignee:
General Electric Company (Niskayuna, NY)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01G - CAPACITORS
DOE Contract Number:  
EE0006433
Resource Type:
Patent
Resource Relation:
Patent File Date: 2015 Dec 09
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Zhang, Lili, Tan, Daniel Qi, and Sullivan, Jeffrey S. Capacitor assembly and related method of forming. United States: N. p., 2017. Web.
Zhang, Lili, Tan, Daniel Qi, & Sullivan, Jeffrey S. Capacitor assembly and related method of forming. United States.
Zhang, Lili, Tan, Daniel Qi, and Sullivan, Jeffrey S. Tue . "Capacitor assembly and related method of forming". United States. https://www.osti.gov/servlets/purl/1414406.
@article{osti_1414406,
title = {Capacitor assembly and related method of forming},
author = {Zhang, Lili and Tan, Daniel Qi and Sullivan, Jeffrey S.},
abstractNote = {A capacitor assembly is disclosed. The capacitor assembly includes a housing. The capacitor assembly further includes a plurality of capacitors disposed within the housing. Furthermore, the capacitor assembly includes a thermally conductive article disposed about at least a portion of a capacitor body of the capacitors, and in thermal contact with the capacitor body. Moreover, the capacitor assembly also includes a heat sink disposed within the housing and in thermal contact with at least a portion of the housing and the thermally conductive article such that the heat sink is configured to remove heat from the capacitor in a radial direction of the capacitor assembly. Further, a method of forming the capacitor assembly is also presented.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2017},
month = {12}
}

Works referenced in this record:

Electrostatic Condenser Housing
patent, August 1949


Mounting device for power capacitor banks
patent, September 1998


Electrolytic capacitor and heat sink assembly
patent, April 1999


Heat sink module and an arrangment of heat sink modules
patent, March 2004


System and method of film capacitor cooling
patent, January 2011


Case-molded capacitor and method for using the same
patent, July 2012


Energy Storage Device Assembly
patent-application, December 2014