Global to push GA events into
skip to main content

Title: Method for fabrication of crack-free ceramic dielectric films

The invention provides a process for forming crack-free dielectric films on a substrate. The process comprises the application of a dielectric precursor layer of a thickness from about 0.3 .mu.m to about 1.0 .mu.m to a substrate. The deposition is followed by low temperature heat pretreatment, prepyrolysis, pyrolysis and crystallization step for each layer. The deposition, heat pretreatment, prepyrolysis, pyrolysis and crystallization are repeated until the dielectric film forms an overall thickness of from about 1.5 .mu.m to about 20.0 .mu.m and providing a final crystallization treatment to form a thick dielectric film. The process provides a thick crack-free dielectric film on a substrate, the dielectric forming a dense thick crack-free dielectric having an overall dielectric thickness of from about 1.5 .mu.m to about 20.0 .mu.m.
Inventors:
; ; ; ;
Issue Date:
OSTI Identifier:
1411430
Assignee:
UCHICAGO ARGONNE, LLC (Chicago, IL) ANL
Patent Number(s):
9,834,843
Application Number:
15/165,427
Contract Number:
AC02-06CH11357
Resource Relation:
Patent File Date: 2016 May 26
Research Org:
Argonne National Lab. (ANL), Argonne, IL (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY

Works referenced in this record:

Effects of the Heat‐Treatment Conditions on the Crystallographic Orientation of Pb(Zr,Ti)O3 Thin Films Prepared by Polyvinylpyrrolidone‐Assisted Sol–Gel Method
journal, September 2007

Chemical solution deposition of ferroelectric lead lanthanum zirconate titanate films on base-metal foils
journal, January 2008
  • Ma, Beihai; Kwon, Do-Kyun; Narayanan, Manoj
  • Journal of Electroceramics, Vol. 22, Issue 4, p. 383-389
  • DOI: 10.1007/s10832-007-9410-1

Dielectric properties of PLZT film-on-foil capacitors
journal, July 2008

Dielectric strength and reliability of ferroelectric PLZT films deposited on nickel substrates
journal, June 2009
  • Ma, Beihai; Narayanan, Manoj; Balachandran, U. (Balu)
  • Materials Letters, Vol. 63, Issue 15, p. 1353-1356
  • DOI: 10.1016/j.matlet.2009.03.021

Fabrication and dielectric property of ferroelectric PLZT films grown on metal foils
journal, July 2011

Densification of the PLZT Films Derived from Polymer-Modified Solution by Tailoring Annealing Conditions
journal, March 2007

Preparation and characterization of lead lanthanum zirconate titanate (PLZT) thin films using an organic self-assembled monolayer template
journal, October 2001

Stress and Cracks in Gel-Derived Ceramic Coatings and Thick Film Formation
journal, January 2003
  • Kozuka, Hiromitsu; Takenaka, Shinsuke; Tokita, Hiroshi
  • Journal of Sol-Gel Science and Technology, Vol. 26, Issue 1-3, p. 681-686
  • DOI: 10.1023/A:1020773415962

Single-Step Deposition of Gel-Derived Lead Zirconate Titanate Films: Critical Thickness and Gel Film to Ceramic Film Conversion
journal, November 2002

Single‐Step Dip Coating of Crack‐Free BaTiO3 Films >1 μm Thick: Effect of Poly(vinylpyrrolidone) on Critical Thickness
journal, May 2000

Development of PLZT dielectrics on base metal foils for embedded capacitors
journal, January 2010

Improved dielectric properties of lead lanthanum zirconate titanate thin films on copper substrates
journal, January 2010

Effects of sintering temperature on the microstructure and dielectric properties of titanium dioxide ceramics
journal, July 2010
  • Chao, Sheng; Petrovsky, Vladimir; Dogan, Fatih
  • Journal of Materials Science, Vol. 45, Issue 24, p. 6685-6693
  • DOI: 10.1007/s10853-010-4761-4

Nucleation- or Growth-Controlled Orientation Development in Chemically Derived Ferroelectric Lead Zirconate Titanate (Pb(ZrxTi1-x)O3, x = 0.4) Thin Films
journal, February 1996

Effect of polyvinylpyrrolidone on the formation of perovskite phase and rosette-like structure in sol-gel–derived PLZT films
journal, August 2007
  • Du, Z. H.; Zhang, T. S.; Ma, J.
  • Journal of Materials Research, Vol. 22, Issue 8, p. 2195-2203
  • DOI: 10.1557/jmr.2007.0283