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Title: Method of accurate thickness measurement of boron carbide coating on copper foil

A method is disclosed of measuring the thickness of a thin coating on a substrate comprising dissolving the coating and substrate in a reagent and using the post-dissolution concentration of the coating in the reagent to calculate an effective thickness of the coating. The preferred method includes measuring non-conducting films on flexible and rough substrates, but other kinds of thin films can be measure by matching a reliable film-substrate dissolution technique. One preferred method includes determining the thickness of Boron Carbide films deposited on copper foil. The preferred method uses a standard technique known as inductively coupled plasma optical emission spectroscopy (ICPOES) to measure boron concentration in a liquid sample prepared by dissolving boron carbide films and the Copper substrates, preferably using a chemical etch known as ceric ammonium nitrate (CAN). Measured boron concentration values can then be calculated.
Issue Date:
OSTI Identifier:
Proportional Technologies, Inc. CHO
Patent Number(s):
Application Number:
Contract Number:
Resource Relation:
Patent File Date: 2015 Nov 12
Research Org:
Proportional Technologies, Inc. Houston, TX (United States)
Sponsoring Org:
Country of Publication:
United States

Other works cited in this record:

Copper-clad polyester-glass fiber laminates using zinc-coated copper
patent, May 1984

Analytical method using laser-induced breakdown spectroscopy
patent, May 1998

Ruthenium and ruthenium dioxide removal method and material
patent, December 2004

Method and apparatus for depth profile analysis by laser induced plasma spectroscopy
patent-application, January 2003

Thickness measuring method for organic coating film on metal surface
patent-application, June 2006

Analysis of component for presence, composition and/or thickness of coating
patent-application, December 2007

Method and Apparatus for Coating Thin Foil With A Boron Coating
patent-application, April 2014

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