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Title: Electroless atomic layer deposition

Abstract

A method of electroless atomic layer deposition is described. The method electrolessly generates a layer of sacrificial material on a surface of a first material. The method adds doses of a solution of a second material to the substrate. The method performs a galvanic exchange reaction to oxidize away the layer of the sacrificial material and deposit a layer of the second material on the surface of the first material. The method can be repeated for a plurality of iterations in order to deposit a desired thickness of the second material on the surface of the first material.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1406567
Patent Number(s):
9803285
Application Number:
14/189,866
Assignee:
National Technology & Engineering Solutions of Sandia, LLC
Patent Classifications (CPCs):
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 2014 Feb 25
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Robinson, David Bruce, Cappillino, Patrick J., Sheridan, Leah B., Stickney, John L., and Benson, David M. Electroless atomic layer deposition. United States: N. p., 2017. Web.
Robinson, David Bruce, Cappillino, Patrick J., Sheridan, Leah B., Stickney, John L., & Benson, David M. Electroless atomic layer deposition. United States.
Robinson, David Bruce, Cappillino, Patrick J., Sheridan, Leah B., Stickney, John L., and Benson, David M. Tue . "Electroless atomic layer deposition". United States. https://www.osti.gov/servlets/purl/1406567.
@article{osti_1406567,
title = {Electroless atomic layer deposition},
author = {Robinson, David Bruce and Cappillino, Patrick J. and Sheridan, Leah B. and Stickney, John L. and Benson, David M.},
abstractNote = {A method of electroless atomic layer deposition is described. The method electrolessly generates a layer of sacrificial material on a surface of a first material. The method adds doses of a solution of a second material to the substrate. The method performs a galvanic exchange reaction to oxidize away the layer of the sacrificial material and deposit a layer of the second material on the surface of the first material. The method can be repeated for a plurality of iterations in order to deposit a desired thickness of the second material on the surface of the first material.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2017},
month = {10}
}

Works referenced in this record:

Platinum Nanofilm Formation by EC-ALE via Redox Replacement of UPD Copper:  Studies Using in-Situ Scanning Tunneling Microscopy
journal, September 2006


Electroless Patterned Assembly of Metal Nanoparticles on Hydrogen-Terminated Silicon Surfaces for Applications in Photoelectrocatalysis
journal, December 2012


Electroless deposition of Pt at a Pd electrode by reaction with sorbed H in Pd/H
journal, July 2000


Atomic-Layer Electroless Deposition: A Scalable Approach to Surface-Modified Metal Powders
journal, April 2014