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Title: Superhydrophobic films and methods for making superhydrophobic films

This disclosure relates to methods that include depositing a first component and a second component to form a film including a plurality of nanostructures, and coating the nanostructures with a hydrophobic layer to render the film superhydrophobic. The first component and the second component can be immiscible and phase-separated during the depositing step. The first component and the second component can be independently selected from the group consisting of a metal oxide, a metal nitride, a metal oxynitride, a metal, and combinations thereof. The films can have a thickness greater than or equal to 5 nm; an average surface roughness (Ra) of from 90 to 120 nm, as measured on a 5 .mu.m.times.5 .mu.m area; a surface area of at least 20 m.sup.2/g; a contact angle with a drop of water of at least 120 degrees; and can maintain the contact angle when exposed to harsh conditions.
Inventors:
; ; ;
Issue Date:
OSTI Identifier:
1399253
Assignee:
UT-Battelle, LLC ORNL
Patent Number(s):
9,771,656
Application Number:
13/596,792
Contract Number:
AC05-00OR22725
Resource Relation:
Patent File Date: 2012 Aug 28
Research Org:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Works referenced in this record:

Magnetofluidics
patent-application, September 2008

Glass product
patent-application, September 2011

Highly hydrophobic coatings
patent-application, October 2011

Cutting tool
patent-application, December 2011

Recent Progress on the Superhydrophobic Surfaces with Special Adhesion: From Natural to Biomimetic to Functional
journal, April 2011
  • Lai, Yue-Kun; Chen, Zhong; Lin, Chang-Jian
  • Journal of Nanoengineering and Nanomanufacturing, Vol. 1, Issue 1, p. 18-34
  • DOI: 10.1166/jnan.2011.1007

Progess in superhydrophobic surface development
journal, January 2008
  • Roach, Paul; Shirtcliffe, Neil J.; Newton, Michael I.
  • Soft Matter, Vol. 4, Issue 2, p. 224-240
  • DOI: 10.1039/B712575P