High flux diode packaging using passive microscale liquid-vapor phase change
Abstract
A laser diode package includes a heat pipe having a fluid chamber enclosed in part by a heat exchange wall for containing a fluid. Wicking channels in the fluid chamber is adapted to wick a liquid phase of the fluid from a condensing section of the heat pipe to an evaporating section of the heat exchanger, and a laser diode is connected to the heat exchange wall at the evaporating section of the heat exchanger so that heat produced by the laser diode is removed isothermally from the evaporating section to the condensing section by a liquid-to-vapor phase change of the fluid.
- Inventors:
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1393161
- Patent Number(s):
- 9768584
- Application Number:
- 15/080,507
- Assignee:
- Lawrence Livermore National Security, LLC
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01S - DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT
- DOE Contract Number:
- AC52-07NA27344
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2016 Mar 24
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY; 36 MATERIALS SCIENCE
Citation Formats
Bandhauer, Todd, Deri, Robert J., Elmer, John W., Kotovsky, Jack, and Patra, Susant. High flux diode packaging using passive microscale liquid-vapor phase change. United States: N. p., 2017.
Web.
Bandhauer, Todd, Deri, Robert J., Elmer, John W., Kotovsky, Jack, & Patra, Susant. High flux diode packaging using passive microscale liquid-vapor phase change. United States.
Bandhauer, Todd, Deri, Robert J., Elmer, John W., Kotovsky, Jack, and Patra, Susant. Tue .
"High flux diode packaging using passive microscale liquid-vapor phase change". United States. https://www.osti.gov/servlets/purl/1393161.
@article{osti_1393161,
title = {High flux diode packaging using passive microscale liquid-vapor phase change},
author = {Bandhauer, Todd and Deri, Robert J. and Elmer, John W. and Kotovsky, Jack and Patra, Susant},
abstractNote = {A laser diode package includes a heat pipe having a fluid chamber enclosed in part by a heat exchange wall for containing a fluid. Wicking channels in the fluid chamber is adapted to wick a liquid phase of the fluid from a condensing section of the heat pipe to an evaporating section of the heat exchanger, and a laser diode is connected to the heat exchange wall at the evaporating section of the heat exchanger so that heat produced by the laser diode is removed isothermally from the evaporating section to the condensing section by a liquid-to-vapor phase change of the fluid.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2017},
month = {9}
}
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Works referenced in this record:
Heat pipe heat sink for cooling a laser diode
patent, February 2003
- Xie, Bo
- US Patent Document 6,517,221
Pump light source for raman amplification
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- US Patent Application 10/098129; 20030142924
Integrated Advanced Heat Spreader for Solid-State Laser Systems
patent-application, February 2013
- Schlie, LaVerne Arthur; Ma, Hongbin
- US Patent Application 13/555884; 20130044776