Global to push GA events into
skip to main content

Title: Fluid-cooled heat sink for use in cooling various devices

The disclosure provides a fluid-cooled heat sink having a heat transfer base, a shroud, and a plurality of heat transfer fins in thermal communication with the heat transfer base and the shroud, where the heat transfer base, heat transfer fins, and the shroud form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.
Inventors:
; ; ;
Issue Date:
OSTI Identifier:
1390168
Assignee:
U.S. Department of Energy NREL
Patent Number(s):
9,759,493
Application Number:
14/626,964
Contract Number:
AC36-08GO28308
Resource Relation:
Patent File Date: 2015 Feb 20
Research Org:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Other works cited in this record:

Method of manufacturing a stacked heat exchanger
patent, May 1996

Stacked fin heat sink and method of making
patent, March 2005

Combined board level shielding and thermal management
patent, January 2008

Thermofluid analysis of staggered and inline pin fin heat sinks
conference, January 2000
  • Dvinsky, A.; Bar-Cohen, A.; Strelets, M.
  • ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
  • DOI: 10.1109/ITHERM.2000.866822

Similar records in DOepatents and OSTI.GOV collections: