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Title: Apparatus for assembly of microelectronic devices

An apparatus including a carrier substrate configured to move a microelectronic device. The apparatus further includes a rotatable body configured to receive the microelectronic device. Additionally, the apparatus includes a second substrate configured to receive the microelectronic device from the rotatable body.
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Issue Date:
OSTI Identifier:
National Technology & Engineering Solutions of Sandia, LLC SNL-A
Patent Number(s):
Application Number:
Contract Number:
Resource Relation:
Patent File Date: 2013 Nov 25
Research Org:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org:
Country of Publication:
United States

Other works cited in this record:

Printing system with printing form having a ferro-electric layer
patent, March 1993

Multi-station rotary die handling device
patent, April 2002

Methods for transferring elements from a template to a substrate
patent, April 2003

Printing of electronic circuits and components
patent, February 2005

Post singulation die separation apparatus and method for bulk feeding operation
patent, August 2005

Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body
patent-application, July 2003

Random-period chip transfer apparatus
patent-application, August 2004

Method for producing microsystems
patent-application, April 2006

Transfer Apparatus
patent-application, January 2008

System For Attaching Electronic Components To Molded Interconnection Devices
patent-application, September 2008

Multilayer Printed Circuit Board And Multilayer Printed Circuit Board Manufacturing Method
patent-application, January 2010

Method For Printing Product Features On A Substrate Sheet
patent-application, December 2012

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