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Title: Apparatus for assembly of microelectronic devices

Abstract

An apparatus including a carrier substrate configured to move a microelectronic device. The apparatus further includes a rotatable body configured to receive the microelectronic device. Additionally, the apparatus includes a second substrate configured to receive the microelectronic device from the rotatable body.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1389770
Patent Number(s):
9763370
Application Number:
14/088,725
Assignee:
National Technology & Engineering Solutions of Sandia, LLC
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B65 - CONVEYING B65G - TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 2013 Nov 25
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Okandan, Murat, Nielson, Gregory N., Cruz-Campa, Jose Luis, Lavin, Judith Maria, and Resnick, Paul J. Apparatus for assembly of microelectronic devices. United States: N. p., 2017. Web.
Okandan, Murat, Nielson, Gregory N., Cruz-Campa, Jose Luis, Lavin, Judith Maria, & Resnick, Paul J. Apparatus for assembly of microelectronic devices. United States.
Okandan, Murat, Nielson, Gregory N., Cruz-Campa, Jose Luis, Lavin, Judith Maria, and Resnick, Paul J. Tue . "Apparatus for assembly of microelectronic devices". United States. https://www.osti.gov/servlets/purl/1389770.
@article{osti_1389770,
title = {Apparatus for assembly of microelectronic devices},
author = {Okandan, Murat and Nielson, Gregory N. and Cruz-Campa, Jose Luis and Lavin, Judith Maria and Resnick, Paul J.},
abstractNote = {An apparatus including a carrier substrate configured to move a microelectronic device. The apparatus further includes a rotatable body configured to receive the microelectronic device. Additionally, the apparatus includes a second substrate configured to receive the microelectronic device from the rotatable body.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2017},
month = {9}
}

Works referenced in this record:

Multi-station rotary die handling device
patent, April 2002


Methods for transferring elements from a template to a substrate
patent, April 2003


Printing of electronic circuits and components
patent, February 2005


Post singulation die separation apparatus and method for bulk feeding operation
patent, August 2005


Random-period chip transfer apparatus
patent-application, August 2004


Method for producing microsystems
patent-application, April 2006


Transfer Apparatus
patent-application, January 2008


System For Attaching Electronic Components To Molded Interconnection Devices
patent-application, September 2008


Multilayer Printed Circuit Board And Multilayer Printed Circuit Board Manufacturing Method
patent-application, January 2010


Method For Printing Product Features On A Substrate Sheet
patent-application, December 2012