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Title: LED module with high index lens

An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.
Inventors:
; ; ; ;
Issue Date:
OSTI Identifier:
1378946
Assignee:
Koninklijke Philips N.V. NETL
Patent Number(s):
9,755,124
Application Number:
15/077,255
Contract Number:
FC26-08NT01583
Resource Relation:
Patent File Date: 2016 Mar 22
Research Org:
Koninklijke Philips N.V. Eindhoven, NL (Netherlands)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 42 ENGINEERING

Works referenced in this record:

Light emitting device
patent-application, April 2007