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Title: Encapsulation of high temperature thermoelectric modules

A method of encapsulating a thermoelectric device and its associated thermoelectric elements in an inert atmosphere and a thermoelectric device fabricated by such method are described. These thermoelectric devices may be intended for use under conditions which would otherwise promote oxidation of the thermoelectric elements. The capsule is formed by securing a suitably-sized thin-walled strip of oxidation-resistant metal to the ceramic substrates which support the thermoelectric elements. The thin-walled metal strip is positioned to enclose the edges of the thermoelectric device and is secured to the substrates using gap-filling materials. The strip, substrates and gap-filling materials cooperatively encapsulate the thermoelectric elements and exclude oxygen and water vapor from atmospheric air so that the elements may be maintained in an inert, non-oxidizing environment.
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Issue Date:
OSTI Identifier:
GM Global Technology Operations LLC DOEEE
Patent Number(s):
Application Number:
Contract Number:
Resource Relation:
Patent File Date: 2014 Aug 26
Research Org:
GM Global Technology Operations LLC, Detroit, MI (United States)
Sponsoring Org:
Country of Publication:
United States

Other works cited in this record:

Thermoelectric module
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Apparatus And Method For Thermal Stabilization Of Pcb-Mounted Electronic Components Within An Enclosed Housing
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Formation Of Glass-Based Seals Using Focused Infrared Radiation
patent-application, January 2014

Solar Thermoelectric Generator With Integrated Selective Wavelength Absorber
patent-application, June 2015

Encapsulated Thermoelectric Modules and Compliant Pads for Advanced Thermoelectric Systems
journal, July 2010
  • Kambe, Mitsuru; Jinushi, Takahiro; Ishijima, Zenzo
  • Journal of Electronic Materials, Vol. 39, Issue 9, p. 1418-1421
  • DOI: 10.1007/s11664-010-1315-0

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