High power RF window deposition apparatus, method, and device
Abstract
A process for forming a coating for an RF window which has improved secondary electron emission and reduced multipactor for high power RF waveguides is formed from a substrate with low loss tangent and desirable mechanical characteristics. The substrate has an RPAO deposition layer applied which oxygenates the surface of the substrate to remove carbon impurities, thereafter has an RPAN deposition layer applied to nitrogen activate the surface of the substrate, after which a TiN deposition layer is applied using Titanium tert-butoxide. The TiN deposition layer is capped with a final RPAN deposition layer of nitridation to reduce the bound oxygen in the TiN deposition layer. The resulting RF window has greatly improved titanium layer adhesion, reduced multipactor, and is able to withstand greater RF power levels than provided by the prior art.
- Inventors:
- Issue Date:
- Research Org.:
- Calabazas Creek Research, Inc. San Mateo, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1368189
- Patent Number(s):
- 9698454
- Application Number:
- 13/937,216
- Assignee:
- Calabazas Creek Research, Inc.
- Patent Classifications (CPCs):
-
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01P - WAVEGUIDES
- DOE Contract Number:
- SC0004571
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2013 Jul 09
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Ives, Lawrence R., Lucovsky, Gerald, and Zeller, Daniel. High power RF window deposition apparatus, method, and device. United States: N. p., 2017.
Web.
Ives, Lawrence R., Lucovsky, Gerald, & Zeller, Daniel. High power RF window deposition apparatus, method, and device. United States.
Ives, Lawrence R., Lucovsky, Gerald, and Zeller, Daniel. Tue .
"High power RF window deposition apparatus, method, and device". United States. https://www.osti.gov/servlets/purl/1368189.
@article{osti_1368189,
title = {High power RF window deposition apparatus, method, and device},
author = {Ives, Lawrence R. and Lucovsky, Gerald and Zeller, Daniel},
abstractNote = {A process for forming a coating for an RF window which has improved secondary electron emission and reduced multipactor for high power RF waveguides is formed from a substrate with low loss tangent and desirable mechanical characteristics. The substrate has an RPAO deposition layer applied which oxygenates the surface of the substrate to remove carbon impurities, thereafter has an RPAN deposition layer applied to nitrogen activate the surface of the substrate, after which a TiN deposition layer is applied using Titanium tert-butoxide. The TiN deposition layer is capped with a final RPAN deposition layer of nitridation to reduce the bound oxygen in the TiN deposition layer. The resulting RF window has greatly improved titanium layer adhesion, reduced multipactor, and is able to withstand greater RF power levels than provided by the prior art.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2017},
month = {7}
}
Works referenced in this record:
Low-pressure chemical vapor deposition process for depositing high-density, highly-conformal, titanium nitride films of low bulk resistivity
patent, September 1993
- Sandhu, Gurtej S.; Buley, Todd W.
- US Patent Document 5,246,881
Nucleation enhancement for chemical vapor deposition of diamond
patent, March 1995
- Stoner, Brian R.; Glass, Jeffrey T.; Hooke, William M.
- US Patent Document 5,397,428
Enhanced RF window for waveguide used with particle accelerator
patent, March 2006
- Berg, Steve W.; Goeppner, George A.; Grelick, Arthur E.
- US Patent Document 7,012,386
Optical Article Coated with an Antireflection Coating Comprising a Sublayer Partially Formed under Ion Assistance and Manufacturing Process
patent-application, July 2010
- Nouvelot, Luc; Rotte, Johann; Scherer, Karin
- US Patent Application 12/664642; 20100183857
Novel Gap Fill Integration
patent-application, June 2011
- Ashtiani, Kaihan; Wood, Michael; Drewery, John
- US Patent Application 12/964110; 20110151678